Title:
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/281773
Kind Code:
A1
Abstract:
The present invention provides a surface-treated copper foil which comprises a copper foil and a surface treatment layer that is formed on at least one surface of the copper foil. The surface treatment layer has an Sku of 2.50 to 4.50 and an Str of 0.20 to 0.40.
Inventors:
MATSUOKA YUKI (JP)
IWASAWA SHOHEI (JP)
GOTO IKUHIRO (JP)
NAKASHIMA SEIYA (JP)
MIKI ATSUSHI (JP)
IWASAWA SHOHEI (JP)
GOTO IKUHIRO (JP)
NAKASHIMA SEIYA (JP)
MIKI ATSUSHI (JP)
Application Number:
PCT/JP2022/001215
Publication Date:
January 12, 2023
Filing Date:
January 14, 2022
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C23C28/00; C25D3/38; C25D3/58; C25D5/16; C25D7/06
Domestic Patent References:
| WO2010110092A1 | 2010-09-30 | |||
| WO2018110579A1 | 2018-06-21 | |||
| WO2014081041A1 | 2014-05-30 | |||
| WO2013047272A1 | 2013-04-04 | |||
| WO2018207786A1 | 2018-11-15 |
Foreign References:
| JPH06169169A | 1994-06-14 | |||
| JP2014139336A | 2014-07-31 | |||
| JP2014506202A | 2014-03-13 | |||
| JP2021085095A | 2021-06-03 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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