Title:
SURFACE-TREATED COPPER FOIL HAVING HEAT RESISTANCE, COPPER CLAD LAMINATE COMPRISING SAME, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/120855
Kind Code:
A1
Abstract:
Disclosed is a surface-treated copper foil having long-term high-temperature reliability, and having low transmission loss so as to be suitable as a high-frequency foil. The present invention provides a surface-treated copper foil having a surface treatment layer comprising: a primary particle layer, which is formed on at least one surface of a copper foil and comprises Cu or Cu alloy particles; and a secondary particle layer, which is formed on the primary particle layer and comprises Zn particles, wherein the secondary particle layer is composed of particle clusters formed by clustering of a plurality of Zn particles.
Inventors:
SEO JUNG WOO (KR)
YANG CHANG YOL (KR)
SONG KIDEOK (KR)
CHOI EUN SIL (KR)
YANG CHANG YOL (KR)
SONG KIDEOK (KR)
CHOI EUN SIL (KR)
Application Number:
PCT/KR2022/010869
Publication Date:
June 29, 2023
Filing Date:
July 25, 2022
Export Citation:
Assignee:
LOTTE ENERGY MAT CORPORATION (KR)
International Classes:
C25D5/10; B32B15/082; C23C22/24; C23C28/00; C25D5/00; C25D7/06; H05K1/03; H05K1/09
Foreign References:
KR100291856B1 | 2001-06-01 | |||
KR100857311B1 | 2008-09-05 | |||
JP2012004221A | 2012-01-05 | |||
CN1545570A | 2004-11-10 | |||
JP2004238647A | 2004-08-26 |
Attorney, Agent or Firm:
HMP IP GROUP (KR)
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