Title:
SURFACE-TREATED COPPER FOIL HAVING PILLAR NODULE STRUCTURE, AND COPPER CLAD LAMINATE AND PRINTED WIRING BOARD COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2024/049027
Kind Code:
A1
Abstract:
A surface-treated copper foil, which has an excellent adhesive strength with respect to a resin substrate and is suitable for application to a high frequency foil, is disclosed. The present invention provides the surface-treated copper foil comprising a surface-treated side formed by surface treatment of an original foil, the surface-treated copper foil comprising a plurality of nodule structures formed on the surface-treated side, wherein the nodule structures include: a pillar part extending from the surface of the surface-treated copper foil; and a branch part extending from a side or an end portion of the pillar part, wherein the surface roughness (Rz) of the surface-treated side is 1.0 ㎛ or less.
Inventors:
SEO JUNG WOO (KR)
YANG CHANG YOL (KR)
CHOI EUN SIL (KR)
YANG CHANG YOL (KR)
CHOI EUN SIL (KR)
Application Number:
PCT/KR2023/011116
Publication Date:
March 07, 2024
Filing Date:
July 31, 2023
Export Citation:
Assignee:
LOTTE ENERGY MAT CORPORATION (KR)
International Classes:
C25D5/00; C25D3/38; H05K1/09; H05K3/18; H05K3/38
Foreign References:
| KR20110071434A | 2011-06-29 | |||
| KR20180003700A | 2018-01-10 | |||
| KR20150103306A | 2015-09-09 | |||
| KR20220087525A | 2022-06-24 | |||
| KR20210078820A | 2021-06-29 |
Attorney, Agent or Firm:
HMP IP GROUP (KR)
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