Title:
SURFACE-TREATED COPPER FOIL AND LAMINATE USING SAME, COPPER FOIL, PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2013/168646
Kind Code:
A1
Abstract:
Provided are: a surface-treated copper foil which can adhere satisfactorily to a resin and which has an advantage in that, when the foil has been removed by etching, the resulting resin exhibits high transparency; and a laminate using the foil. This surface-treated copper foil has roughening particles on the surface, said particles being formed by roughening treatment. In the surface-treated copper foil, the surface which has undergone roughening treatment exhibits a TD average roughness (Rz) of 0.20 to 0.80μm and an MD glossiness at 60°of 76 to 350%, and the A/B ratio is 1.90 to 2.40 [wherein A is the surface area of the roughening particles and B is the area of the roughening particles as observed in the planar view from the surface side of the copper foil.]
Inventors:
ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
MIKI ATSUSHI (JP)
Application Number:
PCT/JP2013/062658
Publication Date:
November 14, 2013
Filing Date:
April 30, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D7/06; B32B15/08; H05K1/09; H05K3/38
Foreign References:
| JP2007332418A | 2007-12-27 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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