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Title:
SURFACE-TREATED COPPER FOIL AND LAMINATE USING SAME, COPPER-CLAD LAMINATE, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/073694
Kind Code:
A1
Abstract:
Provided are a surface-treated copper foil which adheres favorably to resin and achieves excellent resin transparency after removing the copper foil by etching, a laminate using the same, a copper-clad laminate, a printed circuit board, and an electronic device. A surface-treated copper foil having rough particles formed on at least one surface thereof as a result of a roughening treatment, wherein: a copper foil is adhered to both surfaces of a polyimide resin substrate; the copper foil on both surfaces is removed by etching; printed matter on which a linear mark is printed is spread under the exposed polyimide substrate; and an observation point/brightness graph prepared by measuring the brightness at each observation point in a direction perpendicular to the direction in which the observed linear mark extends, in an image obtained by imaging the printed matter using a CCD camera through the polyimide substrate, illustrates that the difference ΔB (ΔB=Bt-Bb) between the top average value (Bt) and the bottom average value (Bb) of a brightness curve produced from the end of the mark to a section not having the mark is 40 or higher.

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Inventors:
ARAI,Hideta (JX Nippon Mining & Metals Corporation3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
MIKI,Atsushi (JX Nippon Mining & Metals Corporation3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
ARAI,Kohsuke (JX Nippon Mining & Metals Corporation3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
NAKAMURO,Kaichiro (JX Nippon Mining & Metals Corporation3,Kurami,Samukawamachi,Koza-gu, Kanagawa 01, 〒2530101, JP)
Application Number:
JP2013/080479
Publication Date:
May 15, 2014
Filing Date:
November 11, 2013
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORPORATION (6-3Otemachi 2-chome, Chiyoda-ku Tokyo, 64, 〒1008164, JP)
International Classes:
C25D7/06; B21B1/40; B21B3/00; C23C28/00; C25D1/04; H05K1/09; H05K3/00
Foreign References:
JP2012212529A
JP2012211351A
JP2011240625A
JP2012224941A
JPH0987889A
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (Shimbashi i-mark Bldg, 6-2 Shimbashi 2-Chome Minato-k, Tokyo 04, 〒1050004, JP)
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