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Title:
SURFACE-TREATED COPPER FOIL AND LAMINATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/073695
Kind Code:
A1
Abstract:
Provided are a surface-treated copper foil which adheres favorably to resin and achieves excellent resin transparency after removing the copper foil by etching, and a laminate using the same. A surface-treated copper foil in which the skewness (Rsk) of at least one surface thereof is -0.35 to 0.53, wherein given that the difference between the top average value (Bt) and the bottom average value (Bb) of a brightness curve produced from the end of the mark to a section on which the mark is not drawn is ΔB (ΔB=Bt-Bb) in an observation point/brightness graph, and when the value expressing the position of the intersection nearest the linear mark among the intersections between the brightness curve and Bt is t1, and the value expressing the position of the intersection nearest the linear mark among the intersections between the brightness curve and 0.1ΔB is t2, in a range up to a depth of 0.1ΔB with Bt from the intersection between the brightness curve and Bt as a reference, then Sv defined in this formula (1) is 3.5 or higher. Sv=(ΔB×0.1)/(t1-t2) (1)

Inventors:
ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
ARAI KOHSUKE (JP)
NAKAMURO KAICHIRO (JP)
Application Number:
JP2013/080480
Publication Date:
May 15, 2014
Filing Date:
November 11, 2013
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D1/04; B21B1/40; B21B3/00; C25D7/06; H05K1/09
Foreign References:
JP2012212529A2012-11-01
JP2012211351A2012-11-01
JP2011240625A2011-12-01
JP2012224941A2012-11-15
JPH0987889A1997-03-31
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
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