Title:
SURFACE TREATED COPPER FOIL, LAMINATE BOARD, COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD FOR PRODUCTION OF PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2014/109396
Kind Code:
A1
Abstract:
Provided are a surface treated copper foil that even when employed in high-frequency circuit boards affords satisfactory reduction of transmission loss, a laminate board, a copper foil with a carrier, a printed wiring board, a printed circuit board, an electronic device, and a method for production of printed wiring board. This surface treated copper foil has a surface treated layer formed thereon, and in a graph depicting deposited amount-surface roughness, wherein the x axis shows the total deposited amount (μg/dm2) of Co, Ni, Fe, and Mo in the surface treated layer, and the y axis shows the surface roughness Rz (μm) of the surface treated surface, the surface treated copper foil lies within a range enclosed by four straight lines, x = 0, y = 0, y = -0.000198x + 1.400000, and y = -0.002333x + 9.333333.
Inventors:
ARAI HIDETA (JP)
FUKUCHI RYO (JP)
FUKUCHI RYO (JP)
Application Number:
PCT/JP2014/050355
Publication Date:
July 17, 2014
Filing Date:
January 10, 2014
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D7/06; H05K1/09
Domestic Patent References:
| WO2005079130A1 | 2005-08-25 |
Foreign References:
| JP2004238647A | 2004-08-26 | |||
| JP2006222185A | 2006-08-24 | |||
| JP2008118163A | 2008-05-22 | |||
| JP4161304B2 | 2008-10-08 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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