Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SURFACE TREATED COPPER FOIL, LAMINATE BOARD, COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD FOR PRODUCTION OF PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2014/109396
Kind Code:
A1
Abstract:
Provided are a surface treated copper foil that even when employed in high-frequency circuit boards affords satisfactory reduction of transmission loss, a laminate board, a copper foil with a carrier, a printed wiring board, a printed circuit board, an electronic device, and a method for production of printed wiring board. This surface treated copper foil has a surface treated layer formed thereon, and in a graph depicting deposited amount-surface roughness, wherein the x axis shows the total deposited amount (μg/dm2) of Co, Ni, Fe, and Mo in the surface treated layer, and the y axis shows the surface roughness Rz (μm) of the surface treated surface, the surface treated copper foil lies within a range enclosed by four straight lines, x = 0, y = 0, y = -0.000198x + 1.400000, and y = -0.002333x + 9.333333.

Inventors:
ARAI,Hideta (JX Nippon Mining & Metals Corporation3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
FUKUCHI,Ryo (JX Nippon Mining & Metals Corporation3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
Application Number:
JP2014/050355
Publication Date:
July 17, 2014
Filing Date:
January 10, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
JX NIPPON MINING & METALS CORPORATION (6-3Otemachi 2-chome, Chiyoda-ku Tokyo, 64, 〒1008164, JP)
International Classes:
C25D7/06; H05K1/09
Domestic Patent References:
WO2005079130A1
Foreign References:
JP2004238647A
JP2006222185A
JP2008118163A
JP4161304B2
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (Shimbashi i-mark Bldg, 6-2 Shimbashi 2-Chome Minato-k, Tokyo 04, 〒1050004, JP)
Download PDF: