Title:
SURFACE-TREATED COPPER FOIL AND LAMINATED SHEET, PRINTED WIRING BOARD, AND ELECTRONIC DEVICE USING SAME, AS WELL AS METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2013/187420
Kind Code:
A1
Abstract:
Provided is a surface-treated copper foil with which adhesion with a resin is good and transparency of the resin after the copper foil has been removed by etching is excellent. Also provided is a laminated sheet using the same. The surface-treated copper foil is obtained by performing roughing treatment of at least one surface of the copper foil in order to form roughing particles such that the roughing particles at the roughed surface comprise per unit surface area at least 50 particles/µm2 of roughing particles having a major axis of 100 nm or less, and have a 60-degree glossiness of the MD at the roughed surface of 76 to 350%.
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Inventors:
ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
MIKI ATSUSHI (JP)
Application Number:
PCT/JP2013/066122
Publication Date:
December 19, 2013
Filing Date:
June 11, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D7/06; B32B15/08; H05K1/03; H05K1/09
Domestic Patent References:
| WO2003096776A1 | 2003-11-20 |
Foreign References:
| JP2007332418A | 2007-12-27 | |||
| JP2004098659A | 2004-04-02 | |||
| JP2849059B2 | 1999-01-20 | |||
| JP2008182222A | 2008-08-07 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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