Title:
SURFACE-TREATED COPPER FOIL AND LAMINATED BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/038717
Kind Code:
A1
Abstract:
Provided are surface-treated copper foil and a laminated board using this surface-treated copper foil which bonds well to resin and yields superior resin transparency after the copper foil has been etched and removed. After surface-treated copper foil has been applied to both surfaces of a 50 μm-thick polyimide resin substrate on the coarsely-treated surface side, the copper foil on both surfaces is etched and removed. A print on which a linear mark has been printed is captured by a CCD camera with an exposed polyimide substrate laid underneath and the print laid on the polyimide substrate. In the captured image, the brightness was measured at each observation point in a direction perpendicular to the direction in which the observed linear mark extends. In the resulting observation point/brightness graph, the difference between the top average value Bt and the bottom average value Bb of the brightness curve produced in the portion at the end of the mark in which the mark has not been rendered ΔB (ΔB = Bt-Bb) is equal to or greater than 40, the ratio ΔB/ΔB(PI) is equal to or greater than 0.7, and the slope (angle) k1 of the brightness curve is from 65° to 87° in the depth range from 0.4 ΔB to 0.6 ΔB with reference to Bt.
Inventors:
ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
ARAI KOHSUKE (JP)
NAKAMURO KAICHIRO (JP)
NAGAURA TOMOTA (JP)
MIKI ATSUSHI (JP)
ARAI KOHSUKE (JP)
NAKAMURO KAICHIRO (JP)
NAGAURA TOMOTA (JP)
Application Number:
PCT/JP2013/074439
Publication Date:
March 13, 2014
Filing Date:
September 10, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D7/06; B21B1/40; B21B3/00; B32B15/088; C25D1/04; H05K1/09
Domestic Patent References:
| WO2012133564A1 | 2012-10-04 | |||
| WO2012133565A1 | 2012-10-04 |
Foreign References:
| JPH0987889A | 1997-03-31 | |||
| JP2011240625A | 2011-12-01 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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