SURFACE-TREATED COPPER FOIL, MANUFACTURING METHOD THEREFOR, PRINTED CIRCUIT BOARD COPPER-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

WIPO Patent Application WO/2016/174970

A1

Provided is a surface-treated copper foil with which strong adhesion to a resin layer can be achieved even with a very flat copper foil surface like that formed by a vapor deposition method such as sputtering and which has a surface treatment layer with a desirable insulation resistance suitable for increased pitch fineness of printed circuit boards. This surface-treated copper foil is provided with a copper foil and a silicon-based surface-treated layer that is provided on at least one surface of the copper foil and is obtained mainly from silicon (Si). When measured by XPS (X-ray photoelectron spectroscopy), carbon concentration in the silicon-based surface treated layer is 1.0-35.0 atom% with respect to 100 atom% total of the three elements, carbon (C), oxygen (O) and silicon (Si), and the oxygen concentration is 12.0-40.0 atom%.

JP2002033186	ORGANIC LIGHT EMITTING ELEMENT
JP2000026950	METALLIC MEMBER HAVING HEAT SHIELD COATING AND FORMATION OF ITS COATING
WO/2021/211676	EXTREME ULTRAVIOLET MASK ABSORBER MATERIALS

MATSUURA YOSHINORI (JP)

PCT/JP2016/059464

November 03, 2016

March 24, 2016

Click for automatic bibliography generation  

MITSUI MINING & SMELTING CO (JP)

C23C14/06; B32B9/00; B32B15/04; B32B15/20; C23C14/14; H05K1/03; H05K3/38

JP2008198953A	2008-08-28
JP2008311328A	2008-12-25
JP2005219258A	2005-08-18
JPH05279870A	1993-10-26
JP2007098732A	2007-04-19
JP2010201620A	2010-09-16
JP2011166018A	2011-08-25

TAKAMURA Masaharu et al. (JP)
Masaharu Takamura (JP)

View/Download PDF      PDF Help

Previous Patent: WATCH MEMBER, WATCH, AND METHOD FOR MANUFACTURING WATCH MEMBER

Next Patent: POWER TOOL