SURFACE TREATED COPPER FOIL AND METHOD FOR PREPARING THE SAME AND COPPER-CLAD LAMINATE USING THE SAME

WIPO Patent Application WO/2001/056343

A1

A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method comprising forming a zinc-copper-nickel ternary alloy plating rust-inhibiting layer on the surface of a copper foil, forming an electrolytic chromate layer on the surface of said rust-inhibiting layer, forming a layer of a silane coupling agent adsorbed on said electrolytic chromate layer, and drying the copper foil for 2 to 6 seconds under a condition wherein the temperature thereof is in the range of 105?C to 200?C. The surface treated copper foil takes full advantage of the effect of a silane coupling agent which is generally used in a copper foil having a zinc-copper-nickel ternary alloy plating rust-inhibiting layer, and thereby exhibits a deterioration percentage for the resistance to hydrochloric acid of 10 % or less even with respect to a copper foil circuit being 0.2 mm wide and further is excellent in moisture resistance.

MITSUHASHI MASAKAZU (JP)
KATAOKA TAKASHI (JP)
TAKAHASHI NAOTOMI (JP)

PCT/JP2001/000432

August 02, 2001

January 24, 2001

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MITSUI MINING & SMELTING CO (JP)
MITSUHASHI MASAKAZU (JP)
KATAOKA TAKASHI (JP)
TAKAHASHI NAOTOMI (JP)

C25D11/38; C23C22/00; C23C22/24; C23C28/00; C23F15/00; C25D1/04; C25D3/38; C25D3/56; C25D5/10; C25D5/16; C25D5/48; C25D7/00; C25D7/06; H05K3/38; (IPC1-7): H05K3/38; C25D7/06

WO1997043466A1

1997-11-20

JPH07231161A	1995-08-29
JPH07258870A	1995-10-09
JPH10341066A	1998-12-22
JPH0974273A	1997-03-18
GB2030176A	1980-04-02

See also references of EP 1185152A4

Tanaka, Daisuke (Hongo 1-chome Bunkyo-ku, Tokyo, JP)

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