Title:
SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, COPPER-CLAD LAMINATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2016/043058
Kind Code:
A1
Abstract:
Provided is a surface-treated copper foil provided with: a copper foil; and a surface treatment layer provided to at least one surface of the copper foil, composed mainly of silicon, and having a hydrogen concentration of 1 to 35 at.% and/or carbon concentration of 1 to 15 at.%. This surface-treated copper foil can be produced by preparing a copper foil and forming, on at least one surface of the copper foil, a surface treatment layer which is composed mainly of silicon and has a hydrogen concentration of 1 to 35 at.% and/or carbon concentration of 1 to 15 at.% by physical vapor deposition or chemical vapor deposition. According to the present invention, it is possible to achieve a high strength of adhesion to a resin layer even with an extremely level copper foil surface such as one formed by a vapor deposition method such as sputtering; it is also possible to provide a copper foil provided with a surface treatment layer that has a desirable insulation resistance suitable for achieving a fine pitch in a printed wiring board.
Inventors:
MATSUURA YOSHINORI (JP)
NISHIKAWA JOE (JP)
KURIHARA HIROAKI (JP)
NISHIKAWA JOE (JP)
KURIHARA HIROAKI (JP)
Application Number:
PCT/JP2015/075080
Publication Date:
March 24, 2016
Filing Date:
September 03, 2015
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C23C14/14; B32B15/08; C23C14/34; H05K3/38
Foreign References:
| JP2008311328A | 2008-12-25 | |||
| JP2005219258A | 2005-08-18 | |||
| JPH05279870A | 1993-10-26 | |||
| JP2007098732A | 2007-04-19 | |||
| JP2010201620A | 2010-09-16 | |||
| JP2010149294A | 2010-07-08 | |||
| JP2007030326A | 2007-02-08 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
Masaharu Takamura (JP)
Masaharu Takamura (JP)
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