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Title:
SURFACE-TREATED COPPER FOIL FOR PRINTED CIRCUIT BOARD, COPPER-CLAD LAMINATE FOR PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2017/099093
Kind Code:
A1
Abstract:
A surface-treated copper foil that is for a printed circuit board and that has a silane coupling agent layer on a surface on which roughened particles have been formed. The average height of the roughened particles on the silane-coupling-agent-layer surface is 0.05 μm or more but less than 0.5 μm, the BET surface area ratio of the of the silane-coupling-agent-layer surface is 1.2 or higher, and the micro-surface coefficient Cms of the silane-coupling-agent-layer surface is 2.0 or higher but less than 8.0.

Inventors:
SAITO, Takahiro (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
EZURA, Takeshi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
Application Number:
JP2016/086281
Publication Date:
June 15, 2017
Filing Date:
December 06, 2016
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO., LTD. (2-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 22, 〒1008322, JP)
International Classes:
C25D7/06; B32B15/04; B32B15/08; C25D5/16; C25D5/48; H05K1/09; H05K3/38
Domestic Patent References:
WO2015087941A12015-06-18
WO2015016271A12015-02-05
Foreign References:
JP2015061757A2015-04-02
JP2015061939A2015-04-02
JP2015105421A2015-06-08
Attorney, Agent or Firm:
IIDA, Toshizo et al. (ISHII Bldg. 3F, 1-10 Shimbashi 3-chome, Minato-k, Tokyo 04, 〒1050004, JP)
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