Title:
SURFACE-TREATED COPPER FOIL FOR PRINTED WIRING BOARDS, AND COPPER-CLADDED LAMINATE BOARD FOR PRINTED WIRING BOARDS AND PRINTED WIRING BOARD EACH USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/193863
Kind Code:
A1
Abstract:
A surface-treated copper foil for printed wiring boards according to the present invention has a surface-treated coating film which has a roughened layer comprising roughening particles formed on at least one surface of a copper foil base, in which the 20-degree specular glossiness Gs (20°) in the TD direction on the surface of the surface-treated coating film as measured in accordance with JIS Z 8741:1997 is less than 0.8%, the 60-degree specular glossiness Gs (60°) in the TD direction on the surface of the surface-treated coating film as measured in accordance with JIS Z 8741:1997 is 0.4% or more, and the specular glossiness ratio of the 45-degree specular glossiness Gs (45°) to the 75-degree specular glossiness Gs (75°) in the TD direction (Gs(45°)/Gs(75°)) on the surface of the surface-treated coating film as measured in accordance with JIS Z 8741:1997 is 0.1 to 1.5, inclusive.
Inventors:
SAITO TAKAHIRO (JP)
NAKATSUGAWA TATSUYA (JP)
NAKATSUGAWA TATSUYA (JP)
Application Number:
PCT/JP2021/012702
Publication Date:
September 30, 2021
Filing Date:
March 25, 2021
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C25D5/16; C25D7/06; H05K1/03; H05K3/38
Domestic Patent References:
| WO2019111914A1 | 2019-06-13 | |||
| WO2003096776A1 | 2003-11-20 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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