Title:
SURFACE-TREATED COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2011/078077
Kind Code:
A1
Abstract:
Disclosed is a surface-treated copper foil characterized by comprising: a copper foil having a roughened surface; and a plating layer that is formed on the roughened surface of the copper foil and comprises cobalt and nickel in the total amount of 75 to 200 μg/dm2 inclusive and at a Co/Ni ratio of 1 to 3 inclusive. The surface-treated copper foil thus formed has excellent alkali etching properties, can retain good hydrochloric acid resistance, heat resistance and weather resistance, and has a reddish surface.
Inventors:
MIKI ATSUSHI (JP)
Application Number:
PCT/JP2010/072755
Publication Date:
June 30, 2011
Filing Date:
December 17, 2010
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
MIKI ATSUSHI (JP)
MIKI ATSUSHI (JP)
International Classes:
C25D7/06; C23C28/00
Foreign References:
| JP2009081396A | 2009-04-16 | |||
| JPH0654829B2 | 1994-07-20 | |||
| JPH0654830B2 | 1994-07-20 | |||
| JPH0654831B2 | 1994-07-20 | |||
| JPH10135594A | 1998-05-22 | |||
| JP2007119902A | 2007-05-17 | |||
| JPS52145769A | 1977-12-05 | |||
| JPS632158A | 1988-01-07 | |||
| JPH01112227A | 1989-04-28 | |||
| JPH01112226A | 1989-04-28 | |||
| JPH0654829A | 1994-03-01 |
Attorney, Agent or Firm:
OGOSHI ISAMU (JP)
Isamu Ogoshi (JP)
Isamu Ogoshi (JP)
Download PDF: