SURFACE TREATED COPPER FOIL - MITSUI MINING & SMELTING CO

Title:

SURFACE TREATED COPPER FOIL

Document Type and Number:

WIPO Patent Application WO/2012/070589

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide a copper foil exerting excellent resistance to softening and capable of preventing the tensile strength from reducing after being subjected to heat treatment at a temperature of 350 to 400°C. In order to achieve said purpose, the present invention adopts a surface treated copper foil provided with an anti-corrosive treatment layer on both surfaces of the copper foil, the copper foil being characterized by containing a minute amount of at least one component selected from among carbon, sulfur, chlorine and nitrogen at a total amount of 100 ppm or more, wherein the anti-corrosive treatment layer is configured from zinc and is a zinc layer having a zinc content of 20 mg/m2 to 1000 mg/m2 on both surfaces.

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Inventors:

OBATA SHINICHI (JP)
HIRAOKA SHINYA (JP)
HOSOKOSHI FUMIAKI (JP)
TATEOKA AYUMU (JP)
MATSUSHIMA HIDEAKI (JP)
MIYAKE KOICHI (JP)
TOMONAGA SAKIKO (JP)
MAEDA TOMOYUKI (JP)

Application Number:

PCT/JP2011/076955

Publication Date:

May 31, 2012

Filing Date:

November 22, 2011

Export Citation:

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Assignee:

MITSUI MINING & SMELTING CO (JP)
OBATA SHINICHI (JP)
HIRAOKA SHINYA (JP)
HOSOKOSHI FUMIAKI (JP)
TATEOKA AYUMU (JP)
MATSUSHIMA HIDEAKI (JP)
MIYAKE KOICHI (JP)
TOMONAGA SAKIKO (JP)
MAEDA TOMOYUKI (JP)

International Classes:

C25D7/06; C23C28/00; C25D5/10; H05K1/09

Foreign References:

JP2008101267A	2008-05-01
JP2003201585A	2003-07-18
JP2006052441A	2006-02-23
JPH0754183A	1995-02-28
JPH04501887A	1992-04-02
JP2010037654A	2010-02-18
JP2005350761A	2005-12-22
JP2009164488A	2009-07-23

Other References: