Title:
SURFACE-TREATED COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2013/147115
Kind Code:
A1
Abstract:
This surface-treated copper foil is characterized in that the amount of adhesion of Si on the copper foil surface is from 3.1 to 300 µg/dm2, and the amount of adhesion of N on the copper foil surface is from 2.5 to 690 µg/dm2. The objective of the present invention is to obtain a copper foil having improved peel strength in providing a copper foil for a flexible printed circuit board (FPC), in which a copper foil is layered on a liquid crystal polymer (LCP) suitable for high-frequency applications.
Inventors:
FUKUCHI RYO (JP)
Application Number:
PCT/JP2013/059454
Publication Date:
October 03, 2013
Filing Date:
March 29, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C23C28/00; B32B15/04; C23C22/24; H05K1/09
Domestic Patent References:
| WO2011138876A1 | 2011-11-10 |
Foreign References:
| JP2011168887A | 2011-09-01 | |||
| JP2008118163A | 2008-05-22 |
Attorney, Agent or Firm:
OGOSHI Isamu et al. (JP)
Isamu Ogoshi (JP)
Isamu Ogoshi (JP)
Download PDF: