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Title:
SURFACE-TREATED COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2013/147116
Kind Code:
A1
Abstract:
This surface-treated copper foil is characterized in that, in an XPS survey measurement of the copper foil surface, the Si concentration is 2.0% or greater and the N concentration is 2.0% or greater. The objective of the present invention is to obtain a copper foil having improved peel strength in providing a copper foil for a flexible printed circuit board (FPC), in which a copper foil is layered on a liquid crystal polymer (LCP) suitable for high-frequency applications.

Inventors:
FUKUCHI RYO (JP)
Application Number:
PCT/JP2013/059455
Publication Date:
October 03, 2013
Filing Date:
March 29, 2013
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C23C28/00; B32B15/04; C23C22/24; H05K1/09
Domestic Patent References:
WO2011138876A12011-11-10
Foreign References:
JP2011168887A2011-09-01
JP2008118163A2008-05-22
Attorney, Agent or Firm:
OGOSHI Isamu et al. (JP)
Isamu Ogoshi (JP)
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