Title:
SURFACE TREATED ELCTROLYTIC COPPER FOIL AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2007/105635
Kind Code:
A1
Abstract:
This invention provides a surface treated electrolytic copper foil, which has
a low profile on an equal or higher level as compared with a low-profile surface
treated electrolytic copper foil which has been supplied on the conventional
market and is small in waviness which affects the linearity of wiring, and a process
for producing the same. In the surface treated electrolytic copper foil, on
the face of adhesion to an insulating layer constituent material, the maximum
level difference of elevation of waviness (Wmax) is 0.05 μm to 0.7 μm,
the maximum difference of elevation of irregularities (PV) is 0.05 to 1.5 μm,
and the surface roughness (Rzjis) is 0.1 μm to 1.0 μm. The electrolytic
copper foil used in the production of the surface treated electrolytic copper
foil is produced by electrolysis under electrolytic conditions of current density
on at least two different levels from continuous first step electrolysis to nth
step electrolysis, using a sulfuric acid-based copper electrolysis solution,
prepared by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide,
a quaternary ammonium salt polymer having a cyclic structure, and chlorine,
and a cathode having a small surface roughness.
Inventors:
DOBASHI MAKOTO (JP)
MATSUDA MITSUYOSHI (JP)
TOMONAGA SAKIKO (JP)
SAKAI HISAO (JP)
SAKATA TOMOHIRO (JP)
YOSHIOKA JUNSHI (JP)
NISHIKAWA JO (JP)
TAGUCHI TAKEO (JP)
MATSUDA MITSUYOSHI (JP)
TOMONAGA SAKIKO (JP)
SAKAI HISAO (JP)
SAKATA TOMOHIRO (JP)
YOSHIOKA JUNSHI (JP)
NISHIKAWA JO (JP)
TAGUCHI TAKEO (JP)
Application Number:
PCT/JP2007/054681
Publication Date:
September 20, 2007
Filing Date:
March 09, 2007
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
DOBASHI MAKOTO (JP)
MATSUDA MITSUYOSHI (JP)
TOMONAGA SAKIKO (JP)
SAKAI HISAO (JP)
SAKATA TOMOHIRO (JP)
YOSHIOKA JUNSHI (JP)
NISHIKAWA JO (JP)
TAGUCHI TAKEO (JP)
DOBASHI MAKOTO (JP)
MATSUDA MITSUYOSHI (JP)
TOMONAGA SAKIKO (JP)
SAKAI HISAO (JP)
SAKATA TOMOHIRO (JP)
YOSHIOKA JUNSHI (JP)
NISHIKAWA JO (JP)
TAGUCHI TAKEO (JP)
International Classes:
C25D1/04; B32B15/08; C25D7/06; H05K1/09
Domestic Patent References:
| WO2003096776A1 | 2003-11-20 |
Foreign References:
| JP2004263296A | 2004-09-24 | |||
| JP2004263289A | 2004-09-24 | |||
| JP3910623B1 | 2007-04-25 | |||
| JPS502378B1 | 1975-01-25 | |||
| JP2005015861A | 2005-01-20 | |||
| JPH09143785A | 1997-06-03 | |||
| JP2004035918A | 2004-02-05 |
Other References:
See also references of EP 1995354A4
Attorney, Agent or Firm:
YOSHIMURA, Katsuhiro (Omiya F Bldg. 5-4, Sakuragicho 2-chome, Omiya-ku, Saitama-sh, Saitama 54, JP)
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