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Title:
SURFACE-TREATED ELECTROLYTIC COPPER FOIL, LAMINATE, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2014/081041
Kind Code:
A1
Abstract:
Provided are a surface-treated electrolytic copper foil, a laminate, and a printed circuit board with which increased fineness of pitch is possible and for which the reliability of resin adherence is excellent. A surface-treated electrolytic copper foil for which the roughness (Rz) of the roughened surface of the copper foil measured using a stylus-type roughness meter is 2.0 µm or less and the kurtosis (Sku) of the roughness curve of the roughened surface is 2-4.

Inventors:
KOHIKI MICHIYA (JP)
INUKAI KENJI (JP)
Application Number:
JP2013/081806
Publication Date:
May 30, 2014
Filing Date:
November 26, 2013
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D7/06; C25D1/04; H05K1/09
Foreign References:
JP2011009267A2011-01-13
JP2009105286A2009-05-14
JP2008285751A2008-11-27
JP2005290519A2005-10-20
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
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