SURFACE-TREATED PLATED MATERIAL AND METHOD FOR PRODUCING SAME, AND ELECTRONIC COMPONENT

Title:

SURFACE-TREATED PLATED MATERIAL AND METHOD FOR PRODUCING SAME, AND ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2014/045678

Kind Code:

A1

Abstract:

Provided is a surface-treated plated material which does not undergo the formation of whiskers, can maintain good soldering properties and low contact resistance even when exposed under a high-temperature environment, and requires small force for inserting a terminal or a connector thereinto. The surface-treated plated material is a plated material in which an under layer comprising a Ni plate or a Ni alloy plate and an upper layer comprising a Sn plate or a Sn alloy plate are formed sequentially on a metal base, wherein P and N exist in the surface of the upper layer and the amounts of P element and N element both adhered on the surface of the upper layer are as follows: P: 1 × 10-11 to 4 × 10-8 mol/cm2; and N: 2 × 10-12 to 8 × 10-9 mol/cm2.

Inventors:

KODAMA ATSUSHI (JP)
SHIBUYA YOSHITAKA (JP)
FUKAMACHI KAZUHIKO (JP)

Application Number:

PCT/JP2013/068557

Publication Date:

March 27, 2014

Filing Date:

July 05, 2013

Export Citation:

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Assignee:

JX NIPPON MINING & METALS CORP (JP)

International Classes:

C25D5/12; C23C28/00; C25D5/48

Domestic Patent References:

WO2007029589A1

2007-03-15

Foreign References:

JP2001059197A	2001-03-06
JPH11350189A	1999-12-21
JP2006082119A	2006-03-30
JP2007063624A	2007-03-15
JP2006124788A	2006-05-18
JP2010093109A	2010-04-22
JP2012084444A	2012-04-26
JPH07173675A	1995-07-11
JPH07173676A	1995-07-11
JP2004360004A	2004-12-24
JP2007197791A	2007-08-09

Other References: