SURFACE TREATING AGENT FOR SUBSTRATE FOR USE IN LITHOGRAPHY

WIPO Patent Application WO/2005/091070

A1

A surface treating agent for use in manufacturing a substrate having a pattern composed of a plurality of regions having different surface free energies by the use of the lithography method, which comprises at least one compound selected from the group consisting of the fluorine-containing compounds having a fluoroalkyl group having one to five carbon atoms or a perfluoropolyether moiety having a molecular weight of 1000 or less. The above surface treating agent can be suitably used for shortening the irradiation time required for patterning a coating film of a surface treating agent by the lithography method.

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MORITA MASAMICHI (JP)
YAMAMOTO IKUO (JP)
ITAMI YASUO (JP)
AOYAMA HIROKAZU (JP)

PCT/JP2005/004803

September 29, 2005

March 17, 2005

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DAIKIN IND LTD (JP)
MORITA MASAMICHI (JP)
YAMAMOTO IKUO (JP)
ITAMI YASUO (JP)
AOYAMA HIROKAZU (JP)

C09D183/08; C09K3/18; C09K13/08; G03F7/004; G03F7/16; (IPC1-7): G03F7/004; C09D183/08; C09K3/18

JP2000507889A	2000-06-27
JP2001516891A	2001-10-02
JP2001117218A	2001-04-27
JP2001270024A	2001-10-02
JP2002023356A	2002-01-23
JPS6445411A	1989-02-17
JPH05331455A	1993-12-14
JP2003145971A	2003-05-21
JPH0586353A	1993-04-06
JPH11279540A	1999-10-12
JP2004306138A	2004-11-04

Kawamiya, Osamu (IMP Building 3-7, Shiromi 1-chome, Chuo-ku, Osaka-sh, Osaka 01, JP)

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