Title:
SURFACE TREATMENT AGENT FOR PD OR ALLOY MAINLY COMPOSED OF PD, AND SURFACE COATING LAYER STRUCTURE OF COPPER SURFACE
Document Type and Number:
WIPO Patent Application WO/2012/073783
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide a surface treatment agent which suppresses oxidation of the surface of Pd or an alloy that is mainly composed of Pd and improves soldering properties such as solder wettability and solder bondability as well as characteristics for serving as a contact. Another purpose of the present invention is to provide a surface treatment agent for obtaining a stable connector terminal that has resistance to mechanical wear and is reduced in abrasive wear of a coating film.
A surface treatment agent for Pd or an alloy that is mainly composed of Pd of the present invention is characterized by being composed of a liquid which is obtained by dissolving a compound having two or more phosphonic acid groups in each molecule but not having an ester bond in each molecule and/or a salt of the compound and one or more substances selected from the group consisting of phosphoric acids in an amount of 0.01 g/L or more in total in a solvent. A surface coating layer structure of a cupper surface of the present invention is characterized in that an Ni film and a Pd film or an alloy film that is mainly composed of Pd are sequentially formed on a copper surface, and then an organic coating film is additionally formed thereon using the surface treatment agent.
Inventors:
OUCHI TAKASHI (JP)
SHIBUYA HIROAKI (JP)
SHIBUYA HIROAKI (JP)
Application Number:
PCT/JP2011/077039
Publication Date:
June 07, 2012
Filing Date:
November 24, 2011
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
JX METALS TRADING CO LTD (JP)
OUCHI TAKASHI (JP)
SHIBUYA HIROAKI (JP)
JX METALS TRADING CO LTD (JP)
OUCHI TAKASHI (JP)
SHIBUYA HIROAKI (JP)
International Classes:
C23F11/00; B23K1/00; B23K1/20; C23C18/16; C23C28/00
Domestic Patent References:
| WO2005085498A1 | 2005-09-15 |
Foreign References:
| JP2008513339A | 2008-05-01 | |||
| JPH11286798A | 1999-10-19 | |||
| JPH10237691A | 1998-09-08 | |||
| JP2007273982A | 2007-10-18 |
Attorney, Agent or Firm:
SAKAI, Masami et al. (JP)
Masami Sakai (JP)
Masami Sakai (JP)
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Claims: