Title:
SURFACE TREATMENT COMPOSITION, SURFACE TREATMENT METHOD USING SAME, AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/055986
Kind Code:
A1
Abstract:
[Problem] To provide a means for suppressing the dissolution rate of tungsten while sufficiently removing impurities remaining on the surface of an object which is to be polished with a polishing agent and which comprises a layer containing at least tungsten and comprises tetraethyl orthosilicate or silicon nitride.
[Solution] This surface treatment composition contains a polymer compound having a sulfonic acid (sulfonate) group, at least one compound selected from amino acids and polyols, and a dispersion medium, and is used to treat the surface of the object which is to be polished with a polishing agent and which comprises a layer containing at least tungsten and comprises tetraethyl orthosilicate or silicon nitride.
Inventors:
CHEN JINGZHI (TW)
Application Number:
PCT/JP2017/030789
Publication Date:
March 29, 2018
Filing Date:
August 28, 2017
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; C11D7/22; C11D7/26; C11D7/32; C11D7/34; C23G1/10
Domestic Patent References:
| WO2013162020A1 | 2013-10-31 |
Foreign References:
| JP2010163608A | 2010-07-29 | |||
| JP2006041494A | 2006-02-09 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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