Title:
SURFACE TREATMENT NOZZLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/035429
Kind Code:
A1
Abstract:
A treatment gas is prevented from leaking from a surface treatment nozzle device.
On a main surface (11f) of a board-like supply groove forming member (11) of a nozzle device (3), a treatment gas supply groove (40) is formed, the main surface (11f) is covered with a covering member (12), and a treatment gas supply means (4) is connected to the treatment gas supply groove (40). An opening groove section (42) is opened on a leading end surface which intersects with the main surface (11f) of the supply groove forming member (11). Furthermore, an outer groove (80) is formed on a part outside the treatment gas supply groove (40) on the main surface (11f) or on the covering surface (12r) of the covering member (12), and the outer groove (80) is connected to a gas sucking means (5).
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Inventors:
YASHIRO, Susumu (2-2, Kamitobakamichoshi-cho, Minami-ku, Kyoto-sh, Kyoto 05, 〒6018105, JP)
Application Number:
JP2009/004612
Publication Date:
April 01, 2010
Filing Date:
September 15, 2009
Export Citation:
Assignee:
SEKISUI CHEMICAL CO., LTD. (4-4 Nishitemma 2-chome, Kita-ku Osaka-sh, Osaka 65, 〒5308565, JP)
積水化学工業株式会社 (〒65 大阪府大阪市北区西天満２丁目４番４号 Osaka, 〒5308565, JP)
積水化学工業株式会社 (〒65 大阪府大阪市北区西天満２丁目４番４号 Osaka, 〒5308565, JP)
International Classes:
C23C16/455; B08B7/00; H01L21/304; H01L21/3065; H01L21/205; H01L21/31; H05H1/24
Attorney, Agent or Firm:
WATANABE, Noboru et al. (Kudanminami Green Bldg. 3F, 7-7 Kudanminami 3-chome, Chiyoda-k, Tokyo 74, 〒1020074, JP)
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