Title:
SURFACE WELDING-FREE TOP COVER ASSEMBLY PROCESS
Document Type and Number:
WIPO Patent Application WO/2019/227460
Kind Code:
A1
Abstract:
A surface welding-free top cover assembly process. Conductive cavities (1122) penetrating a top cover plate (11) are provided at two sides of the top cover plate (11); riveting rings (1111) are provided on the upper end portions of the two sides of the top cover plate (11); the two riveting rings (1111) are respectively arranged around the outer peripheries of the upper openings of the conductive cavities (1122); and a first conductive block (121) and a second conductive block (122) are rivetedly fixed directly by means of the riveting rings (1111).
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Inventors:
WANG SISHENG (CN)
WANG YOUSHENG (CN)
WANG YOUSHENG (CN)
Application Number:
PCT/CN2018/089513
Publication Date:
December 05, 2019
Filing Date:
June 01, 2018
Export Citation:
Assignee:
RDF FAIRY PRECISION TECH CO LTD (CN)
International Classes:
H01M6/00; H01M10/04; H01M50/10
Foreign References:
| CN105702889A | 2016-06-22 | |||
| JP2001176543A | 2001-06-29 | |||
| CN106505163A | 2017-03-15 | |||
| RU2025834C1 | 1994-12-30 |
Attorney, Agent or Firm:
SHENZHEN INPRE PATENTAGENT (GENERAL PARTNERSHIP) (CN)
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