Title:
SUSPENSION PROCESSING DEVICE USING ULTRASONIC WAVES
Document Type and Number:
WIPO Patent Application WO/2014/050320
Kind Code:
A1
Abstract:
In a suspension processing method using ultrasonic waves, there have been problems such as the movement of the solids in the liquid not following the movement of the sound field; therefore, applications in fields where high suspension processing performance or high-speed flow rate processing is necessary are difficult. Designs such as making oscillators long or large for obtaining high suspension processing performance become necessary.
In the present invention, a suspension processing device (30) that uses ultrasonic waves and separates and concentrates solid components in a suspension (1a) has: at least one supply opening (32) that supplies the suspension (1a) into the device; a flow path part (31) in which the suspension flows; at least two discharge openings (33, 34) that discharge the processed suspension (1a); an oscillator (35) that radiates ultrasonic waves; and a reflective plate (36) that reflects the ultrasonic waves that have been radiated.
More Like This:
Inventors:
KAMBAYASHI TAKUYA (JP)
NAKAMURA KENTARO (JP)
NAKAMURA KENTARO (JP)
Application Number:
PCT/JP2013/071387
Publication Date:
April 03, 2014
Filing Date:
August 07, 2013
Export Citation:
Assignee:
HITACHI LTD (JP)
TOKYO INST TECH (JP)
TOKYO INST TECH (JP)
International Classes:
B01J19/10; B01D43/00; C02F1/36
Foreign References:
| JPH02503528A | 1990-10-25 | |||
| US5085783A | 1992-02-04 | |||
| JP2004024959A | 2004-01-29 | |||
| US3076544A | 1963-02-05 | |||
| JPS61500278A | 1986-02-20 |
Attorney, Agent or Firm:
Patent Corporate Body Dai-ichi Kokusai Tokkyo Jimusho (JP)
The first international patent firm of a patent business corporation (JP)
The first international patent firm of a patent business corporation (JP)
Download PDF: