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Title:
SUSPENSION WIRE
Document Type and Number:
WIPO Patent Application WO/2016/181684
Kind Code:
A1
Abstract:
This suspension wire 10 comprises a Cu-15Ni-8Sn alloy and has an outer diameter including a conductive plated layer 2 in the range of 30 μm to 60 μm, a tensile strength of not less than 1400 MPa, and a conductivity in the range of 9%IACS to 18%IASC, and thereby can provide a short, thin, strong suspension wire that sufficiently acts as a spring. The conductive plated layer 2 is preferably a silver plated layer, a copper plated layer or a gold plated layer.

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Inventors:
SAKA KENJI (JP)
Application Number:
PCT/JP2016/055438
Publication Date:
November 17, 2016
Filing Date:
February 24, 2016
Export Citation:
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Assignee:
TOTOKU ELECTRIC (JP)
International Classes:
C22C9/06; C25D7/06; C22F1/00; C22F1/08; G03B5/00
Foreign References:
JP2013127492A2013-06-27
JP2011219840A2011-11-04
JPH11506804A1999-06-15
JPS56265A1981-01-06
Other References:
W.RAYMOND CRIBB ET AL.: "Performance Advances in Copper- Nickel-Tin Spinodal Alloys", ADVANCED MATERIALS & PROCESSES, September 2013 (2013-09-01), pages 20 - 25, XP055328169
Attorney, Agent or Firm:
YOSHIMURA, SHUNICHI (JP)
Toshikazu Yoshimura (JP)
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