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Patent Searching and Data


Title:
SWING ARM FOR POLISHING SLURRY DELIVERY AND POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/143260
Kind Code:
A1
Abstract:
A swing arm for polishing slurry delivery and a polishing device, comprising an arm element (1) provided with a polishing slurry delivery pipe (3) for polishing slurry delivery. A slurry landing-location adjustment block (7) is slidingly disposed at the arm element (1), and is configured to fix a discharge end of the polishing slurry delivery pipe (3). The location of the discharge end of the polishing slurry delivery pipe (3) can be adjusted simply by means of moving the slurry landing-location adjustment block (7), thereby adjusting landing locations of the polishing slurry on a polishing pad without requiring to move the arm element (1).

Inventors:
JIN YANG (CN)
LI WEI (CN)
YIN YING (CN)
LI SI (CN)
Application Number:
PCT/CN2019/111085
Publication Date:
July 16, 2020
Filing Date:
October 14, 2019
Export Citation:
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Assignee:
BEIJING SEMICONDUCTOR EQUIPMENT INSTITUTE THE 45TH RES INSTITUTE OF CETC (CN)
International Classes:
B24B57/02; H01L21/304
Foreign References:
CN109590907A2019-04-09
CN108177089A2018-06-19
CN1828840A2006-09-06
CN106607765A2017-05-03
CN208020018U2018-10-30
CN101829953A2010-09-15
KR20160106407A2016-09-12
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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