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Title:
SWING MECHANISM FOR WAFER DRYING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/246353
Kind Code:
A1
Abstract:
A swing mechanism for a wafer drying apparatus, comprising an accommodating seat (36) used for accommodating a wafer box (9), wherein the accommodating seat (36) comprises a base (360) hollowed out in the middle and connected to an arch-shaped sliding arm (32), side limiting members (361) mounted on the base (360) and used for respectively limiting two sides of the wafer box, a lifting member (363) located between the side limiting members (361), and an inner positioning member (362). The inner positioning member (362) is used for determining the distance between the two side limiting members (361) to provide a mounting position for the lifting member (363), and the inner positioning member (362) and the lifting member (363) are suspended above a hollowed-out portion in the middle of the accommodating seat (36). The hollow side limiting members (361), the inner positioning member (362) and the lifting member (363) form a complete set of mounting structure, which has a mounting positioning function, is easy to mount and high in structural strength, and does not hinder the flow of drying gas, thereby improving the drying effect.

Inventors:
QIAN CHENG (CN)
LI GANG (CN)
ZHOU ZHIYONG (CN)
Application Number:
PCT/CN2023/093358
Publication Date:
December 28, 2023
Filing Date:
May 11, 2023
Export Citation:
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Assignee:
JIANGSU ASIA ELECTRONICS TECH CO LTD (CN)
International Classes:
F26B11/18; F26B25/18; H01L21/67
Domestic Patent References:
WO2013162638A12013-10-31
Foreign References:
CN115218627A2022-10-21
CN115274492A2022-11-01
CN217952968U2022-12-02
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CN114496731A2022-05-13
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CN103367211A2013-10-23
US4762353A1988-08-09
CN110010534A2019-07-12
DE202018104305U12018-09-05
KR20070057307A2007-06-07
CN106057713A2016-10-26
KR20110005489A2011-01-18
CN114485074A2022-05-13
TWM611418U2021-05-01
US20020129838A12002-09-19
Attorney, Agent or Firm:
RUNWEN PATENT LAW FIRM (CN)
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