Title:
SWITCH CONTACT WITH REFRACTORY METAL ALLOY PLATING AND PREPARATION METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2016/011913
Kind Code:
A1
Abstract:
Switch contact with refractory metal alloy plating and preparation method for same; the contact component has a three-layered structure, the first layer being a hydrophobic rubber layer (1), the second layer being a metal sheet layer (2), and the third layer being a refractory metal alloy chemical deposition layer (3). The plating solution used in said chemical deposition contains a soluble tungsten compound and a soluble molybdenum compound. When electroless plating using said plating solution is performed on a layered composite body of the hydrophobic rubber layer and the metal sheet layer, the refractory metal alloy plating (3) is selectively deposited on the metal surface. The switch contact prepared by this method has a good metallic hue, low contact resistance, low production costs, high resistance to electrical arc ablation, and a long service life, and is suitable for heat-cured adhesion and moulding with rubber.
Inventors:
HAN HUISHENG (CN)
WANG ZHENXING (CN)
DING YANG (CN)
ZHANG HONGMEI (CN)
GU JIANXIANG (CN)
WANG ZHENXING (CN)
DING YANG (CN)
ZHANG HONGMEI (CN)
GU JIANXIANG (CN)
Application Number:
PCT/CN2015/084169
Publication Date:
January 28, 2016
Filing Date:
July 15, 2015
Export Citation:
Assignee:
NANTONG MEMTECH TECHNOLOGIES CO LTD (CN)
International Classes:
H01H1/021; C23C18/48; H01H11/04
Foreign References:
| CN104112608A | 2014-10-22 | |||
| CN101809695A | 2010-08-18 | |||
| JP2012107263A | 2012-06-07 | |||
| US6436816B1 | 2002-08-20 |
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