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Title:
SYNTHETIC GRINDING STONE
Document Type and Number:
WIPO Patent Application WO/2020/262211
Kind Code:
A1
Abstract:
A synthetic grinding stone (100) for chemical mechanical grinding of a wafer W according to the present invention comprises: a polishing agent (101) which is mainly composed of fumed silica that has a chemical mechanical grinding action on the wafer W, while having a particle diameter of less than 5 μm; a spherical filler (102) which is mainly composed of spherical silica gel that is formed of a material equal to the wafer W or a soft material, while having a particle diameter that is larger than the particle diameter of the polishing agent (101); and a resin binder (103) which is mainly composed of a cellulose that integrally binds the polishing agent (101) and the spherical filler (102) with each other.

Inventors:
KYOSHIMA KAI (JP)
Application Number:
JP2020/024052
Publication Date:
December 30, 2020
Filing Date:
June 19, 2020
Export Citation:
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Assignee:
TOKYO DIAMOND TOOLS MFG CO LTD (JP)
International Classes:
B24D3/02; B24D3/00; B24D3/28; C09K3/14; H01L21/304
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
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