Title:
SYNTHETIC GRINDING STONE
Document Type and Number:
WIPO Patent Application WO/2021/002216
Kind Code:
A1
Abstract:
A synthetic grinding stone (100) used for chemomechanical grinding of a wafer S is provided with: an abrasive (101) having a chemomechanical grinding action on the wafer S and a main component of cerium oxide having an average particle diameter of not more than 10 µm; a friction promoter (102) having a heat-generating action and a main component of a fibrous material that has a high friction coefficient and a Mohs hardness lower than that of the wafer S; and a binder (103) that has a main component of phenolic resin and that disperses and binds the abrasive (101) and the friction promoter (102).
Inventors:
TSUDA MASAAKI (JP)
Application Number:
PCT/JP2020/024053
Publication Date:
January 07, 2021
Filing Date:
June 19, 2020
Export Citation:
Assignee:
TOKYO DIAMOND TOOLS MFG CO LTD (JP)
International Classes:
B24D3/02; B24D3/00; B24D3/14; B24D3/28; C09K3/14; H01L21/304
Foreign References:
| JPH07241775A | 1995-09-19 | |||
| JP2008229761A | 2008-10-02 | |||
| JP2018521866A | 2018-08-09 | |||
| JPH0386465A | 1991-04-11 | |||
| JP2002086361A | 2002-03-26 | |||
| JPS50140982A | 1975-11-12 | |||
| JP2016514627A | 2016-05-23 | |||
| JP2004087912A | 2004-03-18 | |||
| JP4573492B2 | 2010-11-04 | |||
| JP2004087912A | 2004-03-18 | |||
| JP2016082127A | 2016-05-16 |
Other References:
See also references of EP 3995255A4
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
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