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Patent Searching and Data


Title:
SYNTHETIC GRINDING STONE
Document Type and Number:
WIPO Patent Application WO/2021/002216
Kind Code:
A1
Abstract:
A synthetic grinding stone (100) used for chemomechanical grinding of a wafer S is provided with: an abrasive (101) having a chemomechanical grinding action on the wafer S and a main component of cerium oxide having an average particle diameter of not more than 10 µm; a friction promoter (102) having a heat-generating action and a main component of a fibrous material that has a high friction coefficient and a Mohs hardness lower than that of the wafer S; and a binder (103) that has a main component of phenolic resin and that disperses and binds the abrasive (101) and the friction promoter (102).

Inventors:
TSUDA MASAAKI (JP)
Application Number:
JP2020/024053
Publication Date:
January 07, 2021
Filing Date:
June 19, 2020
Export Citation:
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Assignee:
TOKYO DIAMOND TOOLS MFG CO LTD (JP)
International Classes:
B24D3/02; B24D3/00; B24D3/14; B24D3/28; C09K3/14; H01L21/304
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
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