SYNTHETIC GRINDSTONE - TOKYO DIAMOND TOOLS MFG CO LTD

Title:

SYNTHETIC GRINDSTONE

Document Type and Number:

WIPO Patent Application WO/2008/117883

Kind Code:

A1

Abstract:

Disclosed is a synthetic grindstone used for polishing of a silicon wafer, which is composed of a structure comprising cerium oxide fine particles as abrasive grains, a resin as a binder, a salt as a filler and a nanodiamond as an additive. This synthetic grindstone is characterized in that the purity of the cerium oxide is not less than 60% by weight, the content of the salt as a filler is not less than 1% but not more than 20%, the volume content of the nanodiamond as an additive is not less than 0.1% but less than 20% relative to the total volume of the structure, and the porosity as the volume fraction relative to the total volume of thestructure is less than 30%.

Inventors:

YOSHIDA YUJI (JP)
EDA HIROSHI (JP)
ZHOU LIBO (JP)
KENMOCHI MASAAKI (JP)
TASHIRO YOSHIAKI (JP)
KAMIYA SUMIO (JP)
IWASE HISAO (JP)
YAMASHITA TERUKI (JP)
OTAKE NOBORU (JP)

Application Number:

PCT/JP2008/056279

Publication Date:

October 02, 2008

Filing Date:

March 25, 2008

Export Citation:

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Assignee:

TOKYO DIAMOND TOOLS MFG CO LTD (JP)
TOYOTA MOTOR CORP (JP)
YOSHIDA YUJI (JP)
EDA HIROSHI (JP)
ZHOU LIBO (JP)
KENMOCHI MASAAKI (JP)
TASHIRO YOSHIAKI (JP)
KAMIYA SUMIO (JP)
IWASE HISAO (JP)
YAMASHITA TERUKI (JP)
OTAKE NOBORU (JP)

International Classes:

B24D3/02; B24D3/00; B24D3/28; H01L21/304

Foreign References:

JP2002103238A	2002-04-09
JP2003172839A	2003-06-20
JP2004261942A	2004-09-24
JP2002355763A	2002-12-10
JP2005186246A	2005-07-14
JPS5594981A	1980-07-18
US3328141A	1967-06-27
US5264010A	1993-11-23
JP2001328065A	2001-11-27
JP2002355763A	2002-12-10
JP2000317842A	2000-11-21
JP2001205565A	2001-07-31
JP2005136227A	2005-05-26
JP2005186246A	2005-07-14
JP2002066928A	2002-03-05
JP2006281412A	2006-10-19

Other References: