SYSTEM-IN-PACKAGE AND MOTOR DRIVE CIRCUIT DEVICE

Title:

SYSTEM-IN-PACKAGE AND MOTOR DRIVE CIRCUIT DEVICE

Document Type and Number:

WIPO Patent Application WO/2017/086054

Kind Code:

A1

Abstract:

A system-in-package according to the present invention is used after being connected to an inverter output circuit and has: an analog circuit chip including a plurality of gate driver circuits that output to a terminal electrode a gate drive signal for controlling the switching operation of the inverter output circuit; and a computer chip having a memory in which a motor control program is stored. The system-in-package can switch between a first mode, in which the potential change range of a gate drive signal for controlling the switching operation of a high-side transistor is set to the same range as the potential change range of a gate drive signal for controlling the switching operation of a low-side transistor regardless of the potential at a connection node between a high-side transistor and a high-side transistor in the inverter output circuit, and a second mode, in which the potential change range of the gate drive signal for controlling the switching operation of the high-side transistor is changed according to the potential at the connection node of the inverter output circuit.

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Inventors:

MATSUZAKI KAZUYA (JP)
UE KAZUMASA (JP)
NAKAMARU YUJI (JP)

Application Number:

PCT/JP2016/080032

Publication Date:

May 26, 2017

Filing Date:

October 07, 2016

Export Citation:

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Assignee:

NIDEC CORP (JP)

International Classes:

H02M7/48; H01L25/18; H02P27/06

Foreign References:

JP2013223419A	2013-10-28
JP2002281763A	2002-09-27
JP2005020847A	2005-01-20
JP2001251864A	2001-09-14

Other References: