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Title:
SYSTEM AND METHOD FOR AUTOMATIC MONITORING AND INTELLIGENT ANALYSIS OF FLEXIBLE CIRCUIT BOARD MANUFACTURING PROCESS
Document Type and Number:
WIPO Patent Application WO/2017/084186
Kind Code:
A1
Abstract:
A system and method for automatic monitoring and intelligent analysis of a flexible circuit board manufacturing process. The system comprises a basic information module, a parameter acquisition module, a comprehensive database module, an intelligent data analysis module and a monitoring display and data report module. The parameter acquisition module comprises a microscope automatic data acquisition device and a copper thickness testing device; the microscope automatic data acquisition device acquires the line width and line distance of an etching procedure and the aperture of a drilling procedure; and the copper thickness testing device is adopted to measure the copper thickness, and the statistics of procedure defect data is carried out. A multivariate statistical process control method, a neural network and a support vector machine are adopted as basic analysis methods, so as to perform intelligent analysis on acquired data, predict procedure and production line abnormalities, and identify generated abnormality sources. Automatic monitoring on the manufacturing process and the quality of a flexible circuit board can be realized, and the stability of procedures and the yield of products can be improved.

Inventors:
LUO JIAXIANG (CN)
LI ZHIFU (CN)
LV SIJUN (CN)
WANG JIAPENG (CN)
LI KANGJING (CN)
HU YUEMING (CN)
Application Number:
PCT/CN2015/100210
Publication Date:
May 26, 2017
Filing Date:
December 31, 2015
Export Citation:
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Assignee:
UNIV SOUTH CHINA TECH (CN)
International Classes:
G05B19/418
Domestic Patent References:
WO2005089032A12005-09-22
Foreign References:
CN104238505A2014-12-24
CN104655641A2015-05-27
CN103676868A2014-03-26
CN102147375A2011-08-10
CN103487442A2014-01-01
CN104297254A2015-01-21
Attorney, Agent or Firm:
YOGO PATENT & TRADEMARK AGENCY LIMITED COMPANY (CN)
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