Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SYSTEM AND METHOD FOR COMBINED MICROSEISMIC AND TILTMETER ANALYSIS
Document Type and Number:
WIPO Patent Application WO2005089404
Kind Code:
A3
Abstract:
A system and method for monitoring geophysical processes is disclosed. The system may include a component array located within the bore hole of the active well, or, alternatively, in the bore hole of a nearby offset well, or, alternatively, in multiple shallow boreholes in the surface around the active well. The system may include a sensor array (42) located within a bore, wherein the sensor array has at least one tilt sensor (206, 208) and at least one microseismic sensor (202), a transmitter (201) in communication with the at least one tilt sensor (206, 208) and the at least one microseismic sensor (202), and a receiver in communication with the transmitter (201). In one embodiment, data comprising tiltmeter data and microseismic data from a sensor (206, 208, 202) during at least one geophysical process is received. The microseismic data is analyzed to ascertain a location of each microseismic event of a plurality of microseismic events isolated from the microseismic data, and the tiltmeter data is analyzed to ascertain orientation and dimension of a fracture developed during said at least one geophysical process.

Inventors:
WRIGHT CHRIS (US)
DAVIS ERIC (US)
GRIFFIN LARRY (US)
FISHER KEVIN (US)
KING GEORGE (US)
WARPINSKI NORMAN (US)
WARD JAMES (US)
SAMSON ETIENNE (US)
Application Number:
PCT/US2005/008815
Publication Date:
May 26, 2006
Filing Date:
March 16, 2005
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
PINNACLE TECHNOLOGIES INC (US)
WRIGHT CHRIS (US)
DAVIS ERIC (US)
GRIFFIN LARRY (US)
FISHER KEVIN (US)
KING GEORGE (US)
WARPINSKI NORMAN (US)
WARD JAMES (US)
SAMSON ETIENNE (US)
International Classes:
G01V1/02; E21B43/26; G01V1/00; G01V1/16; G01V1/40; G01V1/46; G01V1/48; G01V1/50
Foreign References:
US20030051873A12003-03-20
US5934373A1999-08-10
US20050017723A12005-01-27
US20040206495A12004-10-21
Download PDF: