CROSS REFERENCE TO RELATED APPLICATIONS

[0001] The present application claims priority to co-pending US Patent Application Serial

No. 13/328,798 filed on December 16, 2011, entitled "SYSTEM FOR COOLING BUILDINGS CONTAINING HEAT GENERATING ELECTRONICS" and copending US Provisional Patent Application Serial No. 61/576,577 filed December 16, 2011, entitled "METHOD FOR COOLING AND MAINTAINING A HEAT GENERATING BUILDING WITHIN A PRESET TEMPERATURE RANGE. These applications are incorporated in their entirety.

FIELD

[0002] The present embodiments generally relate to system and method for cooling portable, liftable, and moveable facilities having heat generating electronics that enables a reduced dependency on air conditioning or chilled water systems relative to conventional systems and methods for cooling facilities containing racked electronics.

BACKGROUND

[0003] A need exists for a system and method that uses less electrical power than current systems for cooling portable buildings.

[0004] A further need exists for a system and method that is implementable on facilities that are portable and transportable and can be transported within containers.

[0005] A further need exists for a system and method that can manage temperatures in multiple portable buildings simultaneously from a single controller connected to a network, and can provide an executive dashboard for continuous simultaneous monitoring and controlling of temperatures therein, thereby preventing overheating while using less power than conventional systems and methods. A need exists for a system and method to cool facilities, such as a portable facility with heat generating electronics that can reduce electrical power usage, such as by an amount as much as 50 percent or more compared to current methods for cooling such facilities.

The present embodiments meet these needs.

BRIEF DESCRIPTION OF THE DRAWINGS

The detailed description will be better understood in conjunction with the accompanying drawings as follows:

Figure 1 depicts a perspective view of a system installed in a facility that can be used to implement the method according to one or more embodiments.

Figure 2 depicts a cut view of the system with an installed heat sink with accompanying equipment in the facility according to one or more embodiments.

Figures 3A-3B depict an embodiment of a controller that can be used to implement the method according to one or more embodiments.

Figure 4A depicts a detailed perspective view of the heat sink according to one or more embodiments.

Figure 4B depicts a detailed cut view of the heat sink according to one or more embodiments.

Figure 5 depicts a side view of the facility with the system installed therein with each heat sink having six outer heat pipe assemblies according to one or more embodiments.

[00015] Figure 6 depicts a perspective view of the system installed into multiple facilities connected together according to one or more embodiments.

[00016] Figure 7 depicts a cross sectional view of the system installed in the facility having outer top mounted heat sinks according to one or more embodiments. [00017] Figure 8 depicts an embodiment of the system installed to a plurality of mobile and/or modular facility controlled by a single controller connected by a network.

[00018] Figure 9 depicts an embodiment of the method for cooling facilities.

[00019] The present embodiments are detailed below with reference to the listed Figures.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[00020] Before explaining the system and method in detail, it is to be understood that the system and method are not limited to the particular embodiments and that they can be practiced or carried out in various ways.

[00021] The present embodiments relate to a system and method for cooling a building or facility with heat generating electronics therein, which can enable heat removal with very low energy consumption.

[00022] For example, the facility can be a portable building, mobile and/or modular facility, data center, or the like. The facility can house telecommunications equipment, servers, and other heat generating electronics racked in vertical units.

[00023] The system and method can be used on a facility that has a plurality of connected walls, an outer top connecting the walls, an inside ceiling connecting the walls, a base connecting to the walls opposite the inside ceiling, and a closable opening, such as a door or man way.

[00024] The system and method can include mounting a heat sink in at least one wall or in the outer top of the facility. In embodiments, two or more heat sinks can be mounted in the walls and/or outer top of the facility. One or more heat sinks can be mounted to form part of the wall or outer top, such that the heat sink forms a non-load bearing integral portion of the wall or outer top. A typical heat sink can be about 72 inches in height, 18 inches in width, and 10 inches in thickness.

[00025] Each facility can have multiple vertical units containing heat generating electronics, and the method can include installing heat sinks in each vertical unit. In one or more embodiments, the method can be performed using multiple outer heat pipe assemblies in conjunction with a single heat sink.

[00026] The system and method can use a heat sink that has a finless heat collecting portion and a fin side with fins. The fin side can be positioned to extend into an interior or chamber of the facility or vertical unit.

[00027] A first interior fan can be installed to flow air from an air flow space between the outer top and inside ceiling, such as out of a first opening in the inside ceiling and into a second segment of the chamber, which can have air at a low British thermal unit (BTU) therein.

[00028] A second interior fan can be installed within a first segment of the chamber to flow air with a high BTU from near the heat generating electronics to the heat sink; thereby allowing the air to quickly cool and then flow into the air flow space, creating an air flow circulation.

[00029] The system and method can include using an outer heat pipe assembly having an outer fluid filled heat collection portion, which can be mounted to the finless side of the heat sink.

[00030] The outer heat pipe assembly can have outer fins opposite the outer fluid filled heat collection portion. The outer fins can extend outwards from the facility. The outer heat pipe assembly can be in thermal communication with the heat sink.

[00031] The outer heat pipe assembly can contain a fluid that can be at a low temperature in the portion adjacent the heat sink. The fluid in the outer heat pipe assembly can be used to absorb heat from the heat sink; thereby forming a heated fluid that can then flow, thermally and without using electricity, to the outer fins of the outer heat pipe assembly. The fluid can be water or another heat transferring fluid.

[00032] A first exterior fan can be installed on the outside of the facility to flow external air over the outer fins, forming a heated air. A second exterior fan can be installed on the outside of the facility to exhaust the heated air from around the outer fins to an area external to the facility.

A controller can be used to control the internal and exterior fans. The controller can include a processor with a data storage, and can be connected to a power supply and a network.

A first powered transducer can be installed within the second segment and connected to the controller for monitoring a cooler chamber air, and comparing the temperature of the cooler chamber air in the second segment to preset limits in the data storage.

A second powered transducer can be secured to a portion of the outer heat pipe assembly for monitoring a temperature of at least one outer fin of the outer heat pipe assembly. The second powered transducer can be connected to the controller, and computer instructions in the data storage can compare the monitored temperatures from the second powered transducer to preset limits in the data storage.

A third powered transducer can be secured proximate to the fins of the heat sink for determining a temperature of inner heated air. The third powered transducer can be connected to the controller. Computer instructions in the data storage can be used to monitor and compare the temperatures from the third powered transducer to preset limits.

The controller can have computer instructions in the data storage for monitoring temperatures in the facility, monitoring heat transfer temperatures, monitoring fan status, actuating fans, regulating fan speeds, and stopping fans, such as when the monitored temperatures from the powered transducers meet or exceed the preset limits.

In one or more embodiments, heat piping can operate without requiring external power inputs to circulate a cooling medium, such as refrigerant compressors, which can be large power consumers. Embodiments of the system and method can operate exclusively using low power air circulation fans to move ambient air over heat sinks to dissipate heat into external air.

[00039] The system and method can include installing a small capacity air conditioning unit in one of the walls of the facility or in each vertical unit of the facility, and connecting the small capacity air conditioning unit to the controller.

[00040] The small capacity air conditioner can be operated by the controller, and can be used to provide an assist to lower the temperature inside the second segment to a temperature less than a temperature outside of the facility.

[00041] For example, a small 1/5 capacity AC unit can be used to supplement cooling of the air in the portable buildings; such as if the external air near the portable buildings is over seventy degrees Fahrenheit.

[00042] In operation, when the heat is dissipated into the external air from the heat sinks, coolant inside the heat piping of the system can be naturally forced back inside a heat source by fluid disposed behind the coolant that has not had the heat removed, thereby causing a natural circulation from hot to cold. The fluid can continue to circulate without external energy inputs as long as an interior or chamber of the portable buildings is hotter than the ambient external air.

[00043] The system and method can be used on a facility that has multiple racks of standard data servers, such as fourteen racks. Total processing power for such a facility can be approximately twenty petabytes depending on the arrangement of the servers. Waste heat generated in this type of typical facility can usually be generated in amounts of about 25 kilowatts (KW) per vertical unit or rack. For example, in a trailer mounted portable facility with fourteen racks, 350 KW in waste heat can be generated.

[00044] A typical cooling system in use today, such as a chill water or standard air conditioning (A/C) unit, can require approximately 99.609 tons of air conditioning per hour to cool this type of typical portable building. The electrical energy requirement can be approximately 211,990 KW/hour to effectively accomplish such cooling, inclusive of losses of heat. For example, the electrical energy costs of operating the typical cooling system hardware for the typical portable building with fourteen racks at an arbitrary cost of $0.05 per KW/hour can be $7,759.00 per month. As such, an energy savings of about $7000 per month can be provided by this dramatically improved system and method for cooling facilities with heat generating electronics.

[00045] One or more of the present embodiments can reduce the costs of power required to cool portable buildings to approximately $620.74 per month, and can dramatically reduce the need for power suppliers to generate the power to cool the portable buildings.

[00046] One or more of the present embodiments can have a significant positive impact on carbon emissions into the environment because less power is required to operate the portable buildings and system. One or more of the present embodiments can accomplish the energy requirement reduction by the elimination of hardware, including large three phase compressors, additional sub-systems inclusive of circulating water pumps, and large discharge blowers, as well as eliminating complicated connection piping. Embodiments can also eliminate the need for a support skid for the system, as well as the need for multiple top and/or multiple side mounted AC units for the portable buildings.

[00047] Typical portable buildings can range in length from about 10 feet to about 60 feet.

One or more embodiments can include a heat pipe configuration that is integral with a wall or ceiling of the portable building, and can form a portion of the wall or ceiling while using fins to collect and dissipate heat, thereby creating a heat transfer process that is highly efficient and reduces electrical consumption by the portable building for cooling by an average of 92 percent.

[00048] For example, the system and method can be used on a facility requiring 200 KW of continuous operation of heat removal to dramatically reduce electrical power requirements to cool that result in savings of as much as $85,000 per year; thereby relieving the energy demands on local utility systems and reducing pollution. Turning now to the Figures, Figure 1 depicts an embodiment of a facility 10, which can be an air cooled mobile and/or modular facility.

The facility 10 can have a plurality of walls, such as wall 11a and wall lib. The facility 10 can have an inside ceiling 70 disposed in parallel and separated from an outside top to form an air flow space, a closable opening 14, and a base 16, which can be connected to the walls 1 la- 1 lb.

The closable opening 14 can be a locking, water-tight, sealed opening, such as a door.

The facility 10 can be made of welded steel, creating an integral structure that can be lifted, such as by a crane. In one or more embodiments, the facility 10 can be made of plate steel having a thickness ranging from about 3/16 of an inch to about 3/4 of an inch.

The facility 10 can have a height ranging from about 8 feet to about 25 feet, width ranging from about 4 feet to 15 about feet, and depth ranging from about 10 feet to about 60 feet.

A small air conditioner 72 can be configured to be installed on a portion of the facility 10 to provide additional cooling when required.

Figure 2 depicts a cut view the facility 10 detailing portions of a system 8.

The facility 10 can have heat generating electronics 18 disposed within a chamber 17. For example, the heat generating electronics 18 can be computer equipment elements, telecommunications equipment, data archival equipment, processing equipment, testing equipment, event recording equipment, logging equipment, power electronics, or combinations thereof.

The heat generating electronics 18 can be racked within the chamber 17 of the facility 10 surrounding an interior portion of the walls lla-l lb of the facility 10. [00058] The heat generating electronics 18 can separate the chamber 17 into a first segment 13 and a second segment 15. The first segment 13 can have air with a first British thermal unit (BTU) content, such as inner heated air 38. The second segment 15 can have air with a second BTU content, such as cooler chamber air 39. The first BTU content can be larger than the second BTU content. In operation, the heat generating electronics 18 can draw in the cooler chamber air 39, such as through a heat generating electronics fan 21, for cooling the heat generating electronics 18. The heat generating electronics 18 can transfer heat to the cooler chamber air 39, thereby forming the inner heated air 38 for expulsion into the first segment 13.

[00059] The facility 10 can have the inside ceiling 70 disposed below the outside top 12 and above the base 16. The air flow space 19 can be formed between the inside ceiling 70 and the outside top 12.

[00060] A first interior fan 22 can be disposed on the inside ceiling 70, and can be used to cool the facility 10 without the need for heavy duty air conditioning systems that consume large amounts of power.

[00061] The first interior fan 22 can be a variable speed low voltage fan with one or more blades. For example, the first interior fan 22 can have a low voltage of 120 volts.

[00062] The first interior fan 22 can be connected to a power supply 24. The first interior fan

22 can blow air from the air flow space 19 towards the base 16, creating a first air flow 26. For example, the first air flow 26 can be at a speed of about 1,150 linear feet per minute.

[00063] The power supply 24 can be a 120 volt, 12 volt, 6 volt, 48 volt, or 220 volt power supply. The power supply 24 can be electricity from an electric municipality grid, a generator, a fuel cell, a battery, a solar cell, a hydroelectric power supply, a wind power generator, or combinations thereof.

[00064] A second interior fan 28 can be connected to the power supply 24 to assist in providing a general circulation of air 31 around the walls l la-l lb, the base 16, and between the outside top 12 and the inside ceiling 70. The second interior fan 28 can be disposed in a portion of the air flow space 19.

[00065] A heat sink 32, which can be a solid material, can be configured to be integrally mounted in one of the walls 11 a- l ib of the facility 10, such as the wall 11a.

[00066] The heat sink 32 can be an extruded metal block, which can be made of copper, aluminum, or alloys thereof. The heat sink 32 can be totally or partially anodized to protect the heat sink 32 from environmental decay and to provide cathodic protection.

[00067] The heat sink 32 can have structural integrity, enabling the heat sink 32 to act as a portion of a non-load bearing wall or non-load bearing ceiling of the facility 10.

[00068] The heat sink 32 can have a length and height equal to or less than the length and height of the wall 11a, and a depth slightly shallower than the wall 11a, such that the heat sink 32 can be attached to a wall frame assembly of the wall 11a.

[00069] The heat sink 32 can have one or more fins connected to a finless heat collecting portion, which can be solid. The fins can contact the inner heated air 38 in the facility 10.

[00070] The fins of the heat sink 32 can transfer heat from the inner heated air 38 while the inner heated air 38 moves across the fins of the heat sink 32. In one or more embodiments, the heat sink 32 can have from about six fins to about four hundred fins.

[00071] The fins can be connected with an outer fluid filed finless heat collection portion of the heat sink 32, allowing for thermal dissipation of heat absorbed by the heat sink 32 into fluid of an outer heat pipe assembly 42 in thermal communication with the outer fluid filed finless heat collection portion. As such, the outer fluid filed finless heat collection portion can form a heated fluid. The outer heat pipe assembly 42 can have outer fins for receiving the heated fluid from the outer fluid filed finless heat collection portion, and allowing for heat dissipation through the outer fins to form a cooled fluid.

The outer fins of the outer heat pipe assembly 42 can be affected by a first external fan 46, which can pull external air 48 over the outer fins of the outer heat pipe assembly 42 through a forced air duct; thereby transferring heat from the outer fins to form a heated air 50.

[00074] A second external fan 52 can exhaust the heated air 50 away from the facility 10.

The first external fan 46 and the second external fan 52 can be variable speed fans, and can be connected to the power supply 24.

[00075] The first interior fan 22, second interior fan 28, first external fan 46, and second external fan 52 can be controlled by a controller 62.

[00076] In embodiments, the controller 62 can be a variable speed controller for causing one or more of the first interior fan 22, second interior fan 28, first external fan 46, and second external fan 52 to operate at one or more speeds simultaneously.

[00077] For example, the controller 62 can include a program logic controller, which can allow the controller 62 to be configured for controlling one or more of the first interior fan 22, second interior fan 28, first external fan 46, and second external fan 52 based on preset limits that can be stored in the controller 62.

[00078] The controller 62 can receive temperature signals from a first powered transducer

54. The first powered transducer 54 can be configured for installation within the facility 10 for determining a first temperature within the facility 10.

[00079] The controller 62 can connect to a second powered transducer 58 secured to a portion of the outer heat pipe assembly 42 for determining a second temperature. The controller 62 can connect to a third powered transducer 60, which can be secured proximate to the fins of the heat sink 32 for determining a third temperature, which can be a temperature of the inner heated air 38.

The first powered transducer 54, the second powered transducer 58, and the third powered transducer 60 can each be connected to both the controller 62 and the power supply 24. Each of the first powered transducer 54, the second powered transducer 58, and the third powered transducer 60 can be standard 100 ohm platinum transducers.

The controller 62 can communicate with a network 74. The network 74 can be the internet, a local area network, satellite network, or another communications network. The network 74 can be in communication with a client device 77 of a user 79, allowing for remote monitoring and controlling of the system 8.

The facility 10 can also have a display 63 disposed therein and in communication with the controller 62, allowing for local monitoring and controlling of the system 8.

The controller 62 can also be connected to the first interior fan 22, the second interior fan 28, the first external fan 46, the second external fan 52, and the power supply 24.

The controller 62 can control the heat sink 32 by controlling air flow using the first interior fan 22, second interior fan 28, first external fan 46, and second external fan 52. In one or more embodiments, the controller 62 can be configured to control one or more of the heat sinks in parallel.

In embodiments, the controller 62 can be configured to dissipate thirty kilowatts of heat per vertical section in the facility 10. Each of the vertical sections can be one vertical portioned off section of the overall facility 10, which can have independent server blades, rackings, and power supplies.

The controller 62 can be configured to control the first interior fan 22, second interior fan 28, first external fan 46, and second external fan 52 to create a lateral airflow between the outside top 12 and the inside ceiling 70 simultaneously while creating an air flow from the heat sink 32 towards the inside ceiling 70 and into the air flow space 19.

[00088] The small air conditioner 72 can be mounted in the outside top 12 or one of the walls

11a- lib, such as the wall lib, and can be connected to the power supply 24 and the controller 62. The small air conditioner 72 can have less than 1/5 of a cooling requirement for cooling the entirety of the facility 10. The small air conditioner 72 can be used when temperatures outside of the facility 10 are above seventy degrees Fahrenheit.

[00089] For example, a preset limit can be seventy degrees Fahrenheit for a low set point and eighty degrees Fahrenheit for a high set point within the facility 10. The controller 62 can use computer instructions in a data storage thereof to keep the first temperature of the cooler chamber air 39 between these two set points, such as by turning on and off the first interior fan 22, second interior fan 28, first external fan 46, and second external fan 52; adjusting the speeds of the first interior fan 22, second interior fan 28, first external fan 46, and second external fan 52; or turning on and off the small air conditioner 72.

Figures 3A-3B depict an embodiment of the controller 62, which can include a processor 64 in communication with the data storage 65 and the display 63.

The data storage 65 can have various computer instructions for monitoring and controlling temperatures inside of one or more facilities.

For example, the data storage 65 can include computer instructions to monitor the temperature of the inner heated air in the facility 66a. The data storage 65 can include computer instructions to monitor the temperature of at least one of the outer fins 66b. The data storage 65 can include computer instructions to monitor the cooler chamber air 66c. The data storage 65 can include computer instructions to compare each monitored temperature to preset limits 66d. [00093] The data storage 65 can include computer instructions to, when the monitored temperatures meet or exceed the preset limits, individually: actuate the first interior fan, second interior fan, first external fan, and second external fan; regulate fan speeds of the first interior fan, second interior fan, first external fan, and second external fan; or turn off the first interior fan, second interior fan, first external fan, and second external fan 66e.

[00094] For example, if the preset limits 69 require the temperature of the cooler chamber air to remain between 70 degrees Fahrenheit and 80 degrees Fahrenheit and the monitored temperature is determined, using one of the powered transducers, to be 85 degrees Fahrenheit, then the computer instructions can instruct the controller 62 to actuate the first interior fan, second interior fan, first external fan, and second external fan, or to increase a speed of the first interior fan, second interior fan, first external fan, and second external fan.

[00095] The data storage 65 can include computer instructions to instruct the processor to compare the monitored temperatures to preset limits, and to control fan speeds individually or simultaneously to cause temperatures in the facility to remain within the preset limits 71.

[00096] The data storage 65 can include computer instructions to allow the processor to turn on and turn off and regulate air flow from the small air conditioner mounted in one of the walls or in the inside ceiling for use when outside air is over seventy degrees Fahrenheit or above another preset value 75.

[00097] The data storage 65 can include computer instructions to provide an alarm message when the monitored temperatures exceed or fall below the preset limits, wherein the alarm message is provided to: the client device, a computer, the display, or combinations thereof 78.

[00098] The data storage 65 can include computer instructions to ensure that air flowing across the inner heat sink remains in contact with each of the heat sinks to optimize heat transfer from the facility 81. [00099] The data storage 65 can include computer instructions to enable the user with the client device to connect to the controller and view a status of temperatures of at least one facility over the network 90.

[000100] The data storage 65 can include computer instructions to form an executive dashboard on the client device enabling the user to simultaneously view the status of the multiple facilities 92.

[000101] The data storage 65 can include computer instructions for instructing the controller to control temperature and cooling of the vertical sections of the facility, wherein the temperature and cooling of the vertical sections is controlled individually, in priority groupings, or simultaneously 93.

[000102] For example, if the facility has three vertical sections, and if only one of the vertical sections is outside of the preset limits 69, then the controller 62 can control one or more of the individual fans associated with that vertical section.

[000103] The data storage 65 can include computer instructions for instructing the controller to control temperature and cooling of the vertical sections of the facility using the network 95.

[000104] The alarm message 79, preset limits 69, and monitored temperatures 67 can be stored in the data storage 65.

[000105] Figure 4A depicts a perspective view of the heat sink 32, and Figure 4B depicts a side cut view of the heat sink 32 and outer heat pipe assembly 42.

[000106] The heat sink 32 can be connected with the outer heat pipe assembly 42. The heat sink 32 can include one or more fins 33 and a coating 68, which can be a non- electrically conductive coating. The coating 68 can be anodized gold, anodized silver, titanium, platinum, iridium, or a similar secondary heat conductive surface for preventing degradation from oxidation or other environmental factors. [000107] In embodiments, the outer heat pipe assembly 42 can be coated, such as with an anodized aluminum, alloy of aluminum, copper, anodized copper, or combinations of these materials.

[000108] The outer heat pipe assembly 42 can be made of a metal pipe and can have an inner diameter that varies depending on a designed heat load. For example, the inner diameter of the outer heat pipe assembly 42 can include thousands of small pipes or capillaries therein, with each small pipe or capillary having an inner diameter of less than two mm. The outer heat pipe assembly 42 can have a pipe base with small pipes and fins, such as those made by ACT in Pennsylvania.

[000109] The fins 33 can be connected to a finless heat collecting portion 36, which can be solid.

[000110] An outer fluid filled finless heat collection portion 43 of the outer heat pipe assembly 42 can be disposed adjacent one or more outer fins 44, and between the outer fins 44 and the finless heat collecting portion 36. The outer fluid filled finless heat collection portion 43 can be in thermal communication with the finless heat collecting portion 36.

[000111] The outer fluid filed finless heat collection portion 43 can allow for thermal dissipation of heat absorbed by the heat sink 32 into fluid of the outer fins 44 of the outer heat pipe assembly 42.

[000112] The outer heat pipe assembly 42 can have a fan assembly, including the first external fan 46 and the second external fan 52 for forced air cooling.

[000113] In operation, heat from the inner heated air can be transferred to the fins 33, heat from the fins 33 can be transferred to the finless heat collecting portion 36, heat from the finless heat collecting portion 36 can be transferred to the outer fluid filed finless heat collection portion 43, and heat from the outer fluid filed finless heat collection portion 43 can be transferred to the outer fins 44. [000114] For example, the outer fluid filed finless heat collection portion 43 can transfer heat from the finless heat collecting portion 36 into a fluid to form a heated fluid 40. The outer fins 44 can receive the heated fluid 40 from the outer fluid filed finless heat collection portion 43. Heat from the heated fluid 40 can be dissipated through the outer fins 44, thereby forming a cooled fluid 45, which can flow back to the outer fluid filed finless heat collection portion 43.

[000115] For example, the first external fan 46 can draw in the external air 48 into a forced air duct 83, which can receive the external air 48 and flow the external air 48 across the outer fins 44, thereby causing a heat exchange and forming the heated air 50.

[000116] The second external fan 52 can draw the heated air 50 out away from the outer fins

44. The second external fan 52 can operate at a higher suction to draw the external air 48 through the outer heat pipe assembly 42.

[000117] In one or more embodiments, the outer fins 44 can be very thin and short microstructures. A large quantity of the very thin and short microstructures can provide for fast and lightweight thermal dissipation.

[000118] In one or more embodiments, the outer heat pipe assembly 42 can have several hundred of the outer fins 44.

[000119] Figure 5 depicts a side view of an outside of the facility 10 with one heat sink having six outer heat pipe assemblies 42a-42f.

[000120] The facility 10 can have the vertical sections 76a-76g. Each of the vertical section

76a-76g can contain racks with servers that generate heat or other heat generating electronics.

[000121] The facility 10 can have the first external fans 46a-46n for drawing in the exterior air, and the second external fans 52a-52n for expelling the heated air. [000122] Each of the first external fans 46a-46n and the second external fans 52a-52n for each of the vertical sections 76a-76g can be operated independently, simultaneously, or in priority groupings.

[000123] The facility 10 can have the small air conditioner 72, which can be a 15 ton A/C unit, such as one made by TRANE™.

[000124] The facility 10 can be installed in a transportable container 73, such as a shipping container for easy transport by land or sea. In one or more embodiments, the transportable container 73 can contain multiple facilities.

[000125] The transportable container 73 can be a vertical lift container, skid mounted container, or a container that is transportable by rail, boat, or truck.

[000126] In one or more embodiments, the transportable container 73 can be a moveable custom made container, which can provide additional protection and additional space for the facility 10.

[000127] Figure 6 depicts an embodiment of the system installed into multiple facilities 10a- 10b that are connected together.

[000128] The walls 11a- 11c of the facilities 10a- 10b can be removed and/or connected together, such that the facilities share the means for flowing air. For example, the wall 1 la of the facility 10a can be connected with the wall 1 lc of the facility 10b.

[000129] The facilities 10a- 10b can have one or more of the heat sinks 32a-32b for transferring heat from within the facilities 10a- 10b, as well as the outer heat pipe assemblies 42 for transferring the heat to the external air.

[000130] Figure 7 depicts an embodiment of the facility 10 with the closable opening 14, as well as the inside ceiling 70 and the outside top 12 forming the air flow space 19.

[000131] The inside ceiling 70 can have a first opening 23. The first interior fan 22 can blow air from within the air flow space 19 into the chamber 17 through the first opening 23. [000132] The second interior fan 28 can blow air from a second opening 25 of the inside ceiling 70 into the air flow space 19, thereby creating a cross air flow 80.

[000133] The facility 10 can have the heat sink 32a, which can be wall mounted into one of the walls 11 a- l ib, such as the wall 11a. For example, the heat sink 32a can be disposed adjacent the heat generating electronics 18.

[000134] The facility 10 can have the heat sink 32b and the heat sink 32c, which can both be configured to be installed on the outside top 12. For example, the heat sink 32b and the heat sink 32c can be used when the heat generating electronics 18 vent upwards into the air flow space 19.

[000135] Each of the heat sinks 32a-32c can be associated with the outer heat pipe assemblies

42a, 42b, and 42c, which can each have two pairs of circulating fans to provide for faster thermal heat transfer from the chamber 17 of the facility 10 to an outside of the facility 10.

[000136] Each of the heat sinks 32a-32c associated with the outer heat pipe assemblies 42a- 42c can be connected to the controller 62.

[000137] Figure 8 depicts a plurality of facilities 10a- 10b controlled by one of the controllers

62.

[000138] The plurality of facilities 10a- 10b can be connected to the controller 62, and the controller 62 can be connected to the network 74.

[000139] The client device 77 can be connected to the controller 62 and facilities 10a- 10b through the network 74, allowing the user 79 to remotely monitor temperatures and receive alarm messages. The client device 77 can be a cell phone, computer, or other communications device.

[000140] The controller 62 can simultaneously operate the plurality of facilities 10a- 10b. The facilities 10a- 10b can have thermal partitions 35a-35h formed by the heat generating electronics 18a-18d that extend from the bases 16a- 16b to the inside ceilings 70a- 70b.

[000141] The thermal partitions 35a-35h can form the chambers 17a and 17b, thereby separating the inner heated air 38a-38d from the cooler chamber air 39a-39d.

[000142] Each of the facilities lOa-lOb can have the display 63a-63b for locally displaying temperatures and information on the system.

[000143] Each of the facilities 10a- 10b can have one or more of the heat sinks 32a-32d, which can contact the inner heated air 38a-38d for cooling thereof. Each of the facilities 10a- 10b can have one or more outer heat pipe assemblies 42a-42d, which can transfer heat to the external air.

[000144] Each of the chambers 17a- 17b can have one or more of the first interior fans 22a- 22d. For example, the chamber 17a can have the first interior fan 22a and the first interior fan 22b, and the chamber 17b can have the first interior fan 22c and the first interior fan 22d.

[000145] The first interior fans 22a-22d can receive air from the second interior fans 28a-28d through the air flow space 19a- 19b, and can provide the cooler chamber air 39a-39d to the chambers 17 a- 17b.

[000146] Each of the facilities 10a- 10b can have the walls 11a- l id and outside tops 12a- 12b.

[000147] Figure 9 depicts a diagram of an embodiment of the method for cooling a facility, such as a facility.

[000148] The method can include mounting the heat sink in at least one wall or outside top of the facility containing the heat generating electronics, forming a non-load bearing integral portion of the wall or outside top, as illustrated by box 100.

[000149] The method can include mounting the outer heat pipe assembly to the finless heat collecting portion of the heat sink, as illustrated by box 102. [000150] The method can include installing the forced air ducts around the outer heat pipe assembly to contain air flow around the heat pipes, as illustrated by box 104.

[000151] The method can include installing the first external fan to force air into the forced air duct from outside of the facility, as illustrated by box 106.

[000152] The method can include installing the second external fan to pull air from the forced air duct to outside of the facility, as illustrated by box 108.

[000153] The method can include installing the first interior fan to flow air from a ceiling air duct into the facility, as illustrated by box 110.

[000154] The method can include installing the second interior fan to pull air from the facility into the ceiling air duct, as illustrated by box 112.

[000155] The method can include installing the first powered transducer in the facility proximate to a section of the facility having the lowest temperature, as illustrated by box 114.

[000156] The method can include installing the second powered transducer in the facility in the air flow proximate to the fins of the outer heat pipe assembly, as illustrated by box 116.

[000157] The method can include installing the third powered transducer proximate to the fins of the heat sink, as illustrated by box 118.

[000158] The method can include connecting the first powered transducer, second powered transducer, third powered transducer, first external fan, second external fan, first interior fan, and second interior fan to the controller, wherein the controller has the processor and the data storage, as illustrated by box 120.

[000159] The method can include using computer instructions in the data storage to monitor temperature in the facility, actuate the fans, regulate the fan speeds, and stop the fans when monitored temperatures of the facility meet or exceed preset limits, as illustrated by box 122. [000160] The method can include installing a small capacity air conditioning unit, connecting the small capacity air conditioning unit to the controller, and providing an assist to lower the temperature of air in the facility to a temperature less than the temperature outside of the facility, as illustrated by box 124.

[000161] While these embodiments have been described with emphasis on the embodiments, it should be understood that within the scope of the appended claims, the embodiments might be practiced other than as specifically described herein.