SYSTEM AND METHOD FOR HEATING AND COOLING WAFER AT ACCELERATED RATES

Title:

SYSTEM AND METHOD FOR HEATING AND COOLING WAFER AT ACCELERATED RATES

Document Type and Number:

WIPO Patent Application WO2003081646

Kind Code:

A3

Abstract:

A highly dynamic heating and/or chilling chamber for processing semiconductor wafers. The chamber has uniform heat and gas flow distribution in order to minimize the temperature gradient at different point of the wafer.

Inventors:

RENKEN WAYNE G (US)

Application Number:

PCT/US2003/008464

Publication Date:

March 18, 2004

Filing Date:

March 18, 2003

Export Citation:

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Assignee:

SENSARRAY CORP (US)
RENKEN WAYNE G (US)

International Classes:

H01L21/00; H01L21/027; (IPC1-7): H01L21/00

Domestic Patent References:

WO2000062333A1	2000-10-19
WO2000046840A1	2000-08-10
WO2000077833A2	2000-12-21

Foreign References:

US5772770A	1998-06-30
US6111225A	2000-08-29
US5287914A	1994-02-22
US20010050059A1	2001-12-13
US5536918A	1996-07-16

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