Title:
SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/083374
Kind Code:
A1
Abstract:
A wafer processing system (1) is provided. The system (1) includes a processing tool (10) comprising at least one grinding member (16) used to remove material from a wafer substrate (80). The system (1) also includes an electrolyte supply line (361) used to supply an electrolyte to the wafer substrate (80). The system (1) further includes a holding module (20) for holding the wafer substrate (80). The holding module (20) includes a conductive base (21) and a conductive porous member (22) positioned on the top surface of the conductive base (21). A vacuum source (53) fluidly communicated with fluid channel (214) formed in the conductive base (21) to create a vacuum to hold the wafer substrate (80) on the conductive porous member (22). In addition, the system (1) includes an actuator assembly for driving a rotation of the grinding member (16) and a rotation of the conductive base (21), and a power supply module (45) to apply an electric current to the grinding member (16) and to the conductive porous member (22) through the conductive base (21).
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Inventors:
YANG YAO-GUANG (CN)
LAN KUEN-CHIH (CN)
CHEN WEI-HAU (CN)
FAN ZHI WEN (CN)
CHEN CHAO-CHANG (CN)
LAN KUEN-CHIH (CN)
CHEN WEI-HAU (CN)
FAN ZHI WEN (CN)
CHEN CHAO-CHANG (CN)
Application Number:
PCT/CN2022/131956
Publication Date:
May 19, 2023
Filing Date:
November 15, 2022
Export Citation:
Assignee:
COMPTAKE TECH INC (CN)
International Classes:
C25F3/30; B23H5/08; B24B37/04; H01L21/302; H01L21/461
Foreign References:
| JP2013176838A | 2013-09-09 | |||
| US20090061741A1 | 2009-03-05 | |||
| CN101920476A | 2010-12-22 | |||
| CN112975592A | 2021-06-18 | |||
| US20040214510A1 | 2004-10-28 | |||
| US20180015508A1 | 2018-01-18 |
Attorney, Agent or Firm:
LEE AND LI - LEAVEN IPR AGENCY LTD. (CN)
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