Title:
SYSTEM OF PATH PLANNING FOR ROBOTIC MANIPULATORS BASED ON MAXIMUM ACCELERATION AND FINITE JERK CONSTRAINTS
Document Type and Number:
WIPO Patent Application WO2004095520
Kind Code:
A3
Abstract:
A system for wafer handling employing a complex numerical method for calculating a path of wafer travel that controls wafer acceleration and jerk, and results in maximum safe speed of wafer movement from a first point to a second point. Motion is begun along a straight line segment while accelerating to a first path velocity. During this acceleration, the system computer calculates a series of straight line segments and interconnecting sinusiodally shaped paths over which the wafer is to be guided to the second point. The straight line segments and sinusiodally shaped paths are calculated so as to minimize total path length and the time required to move the wafer from the first point to the second point. The system computes the point of entrance and exit to and from each straight and sinusoidal path.
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Inventors:
ROGERS JOHN
PADMANABHAN PRASAD
SAGUES PAUL
PADMANABHAN PRASAD
SAGUES PAUL
Application Number:
PCT/US2004/012639
Publication Date:
August 18, 2005
Filing Date:
April 22, 2004
Export Citation:
Assignee:
BERKELEY PROCESS CONTROL INC (US)
International Classes:
B25J9/16; G05B19/4103; G06F19/00; (IPC1-7): G06F7/00
Foreign References:
| US5655060A | 1997-08-05 | |||
| US6216058B1 | 2001-04-10 |
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