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Patent Searching and Data


Title:
SYSTEM FOR REMOVING AND COLLECTING FINE CUTTING CHIPS BY USING UNEVEN SCRAPER AND ELASTIC SCRAPER
Document Type and Number:
WIPO Patent Application WO/2020/017700
Kind Code:
A1
Abstract:
The present invention relates to a system for removing and collecting fine cutting chips by using an uneven scraper and an elastic scraper, wherein the system is capable of: scraping and collecting fine cutting chips and a cutting fluid that are deposited below a cutting apparatus, by using an elastic scraper and an uneven scraper that move in one direction; separately discharging only the cutting fluid by means of a perforated plate having a smaller diameter than the cutting chips so as to be recycled; and separately collecting and disposing of only the scraped fine cutting chips.

Inventors:
YANG JAE YEOL (KR)
Application Number:
PCT/KR2018/013167
Publication Date:
January 23, 2020
Filing Date:
November 01, 2018
Export Citation:
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Assignee:
SAMHEUNG PREC CO LTD (KR)
International Classes:
B23Q11/00; B65G19/04; B65G19/20; B65G19/22
Foreign References:
JP3212747U2017-09-28
JP2008201573A2008-09-04
KR200485416Y12018-01-04
JP2001138170A2001-05-22
KR20160003663U2016-10-24
Attorney, Agent or Firm:
SHIN, Dong Gee (KR)
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