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Title:
SYSTEM FOR SPECIFYING DEFECT CAUSE IN VAPOR DEPOSITION MASK, METHOD FOR SPECIFYING DEFECT CAUSE IN VAPOR DEPOSITION MASK, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2020/218396
Kind Code:
A1
Abstract:
This system for specifying a defect cause in a vapor deposition mask, the mask having a substrate in which a plurality of holes are formed, comprises: an image acquisition unit for acquiring a captured image of the vapor deposition mask which includes a plurality of hole portions in which the plurality of holes are imaged, the hole portions including normal hole portions and defective hole portions, and a substrate portion in which the substrate surrounding the plurality of holes is imaged; a first area calculation unit for calculating the area of the normal hole portions included in the captured image acquired by the image acquisition unit; a second area calculation unit for calculating the area of the defective hole portions included in the captured image acquired by the image acquisition unit; an area ratio calculation unit for calculating an area ratio which is the proportion of the area of the defective hole portions to the area of the normal hole portions; and a defect cause specifying unit for specifying a cause of the defective hole portions. The defect cause specifying unit specifies that the cause of the defective hole portions is a first cause or a second cause when the area ratio is 1 or greater, and specifying that the cause of the defective hole portions is neither the first cause nor the second cause when the area ratio is less than 1.

Inventors:
YAMADA KIYOHARU (JP)
SHIBATA HIROMICHI (JP)
FUJITO TAISEI (JP)
Application Number:
PCT/JP2020/017429
Publication Date:
October 29, 2020
Filing Date:
April 23, 2020
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
C23C14/04; G01N21/956
Foreign References:
JP2006046943A2006-02-16
JP2000028539A2000-01-28
JP2018044219A2018-03-22
US4555798A1985-11-26
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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