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Title:
SYSTEMS AND APPARATUS FOR HOUSING ELECTRONIC COMPONENTS AND METHODS THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/146960
Kind Code:
A3
Abstract:
A structure for housing electronic components. The structure includes a first layer and a second layer. One or more layers may each have a modulus of elasticity of less than 2.41 MPa. One or more layers may be at least partially affixed to form a combined layer. The combined layer may have a combined modulus of elasticity of less than 2300 MPa. The combined layer may be transparent to electromagnetic waves. The combined layer may be not electrically conductive across an entire surface area of the combined layer. The combined layer may be polycarbonate free. An outermost layer may be a textile layer.

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Inventors:
JENKINS KURT (US)
REED ANTHONY (US)
O'CONNELL NEIL (US)
ISHIHARA JAMES ALEC (US)
Application Number:
PCT/US2017/018020
Publication Date:
October 19, 2017
Filing Date:
February 16, 2017
Export Citation:
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Assignee:
MICROSOFT TECHNOLOGY LICENSING LLC (US)
International Classes:
B32B5/02; B32B5/18; B32B5/24; B32B5/26; B32B9/02; B32B15/14; B32B27/12
Domestic Patent References:
WO2015079820A12015-06-04
WO2016005942A12016-01-14
WO2012110091A12012-08-23
WO2007021611A12007-02-22
Foreign References:
US20150138743A12015-05-21
US20080187734A12008-08-07
Attorney, Agent or Firm:
MINHAS, Sandip et al. (US)
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