Title:
SYSTEMS AND METHODS FOR PROVIDING DATA CHANNELS AT A DIE-TO-DIE INTERFACE
Document Type and Number:
WIPO Patent Application WO/2016/060780
Kind Code:
A9
Abstract:
A circuit includes a first die having a first array of exposed data nodes, and a second die having a second array of exposed data nodes, wherein a given data node of the first array corresponds to a respective data node on the second array, further wherein the first array and the second array share a spatial arrangement of the data nodes, wherein the first die has data inputs and sequential logic circuits for each of the data nodes of the first array on a first side of the first array, and wherein the second die has data outputs and sequential logic circuits for each of the data nodes of the second array on a second side of the second array, the first and second sides being different.
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Inventors:
PETERSON LUVERNE RAY (US)
BRYAN THOMAS CLARK (US)
LOKE ALVIN LENG SUN (US)
WEE TIN TIN (US)
LYNCH GREGORY FRANCIS (US)
KNOL STEPHEN ROBERT (US)
BRYAN THOMAS CLARK (US)
LOKE ALVIN LENG SUN (US)
WEE TIN TIN (US)
LYNCH GREGORY FRANCIS (US)
KNOL STEPHEN ROBERT (US)
Application Number:
PCT/US2015/050596
Publication Date:
December 01, 2016
Filing Date:
September 17, 2015
Export Citation:
Assignee:
QUALCOMM INC (US)
International Classes:
G06F1/10; G06F17/50; G11C7/22; H04L7/00
Attorney, Agent or Firm:
KELTON, Thomas W. et al. (LLPIP Section,2323 Victory Avenue, Suite 70, Dallas Texas, US)
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