MONITORING DEVICE

BACKGROUND

[00011 The subject matter disclosed herein relates to temperature monitoring devices, and more specifically to surface temperature monitoring devices (e.g., surface temperature loggers, s rface temperature sensors, and surface thermal probes).

[0002) Temperature monitoring devices, such as temperature loggers and temperature sensors, may be used to monitor temperatures within a system. That is, temperature monitoring devices may be used to collect and store temperature measurements for a particular portion of a monitored system over a period of time. For example, a temperature logger may function to col lect and store air temperature measurements for a particular room of an office building over the course of a day. Temperature monitoring devices may be used to investigate the thermal properties of the monitored system , such as the heat capacity of certain components of the system, heat transfer between certain components of the system, competing heat transfer paths in the system, energy loses due to heat transfer within the system, temperature stabi lity of the system, and so forth. As such, temperature monitoring devices may be used to collect temperature measurement data that may be used, for example, to control operation of the monitored system, to verify proper operation of the monitored system for qual ity control purposes, and to determine how the monitored system may be modified or reengineered to improve the thermal efficiency of the system.

BRI EF DESCRI PTION

[0003] Certain embodiments commensurate in scope with the original ly claimed invention are summarized below. These embodiments are not intended to limit the scope of the claimed invention, but rather these embodiments are i ntended only to provide a brief summary of possible forms of the invention. Indeed, the invention may encompass a variety of forms that may be similar to or different from the embodiments set forth below. [0004] In an embodiment, a system includes a temperature monitoring device configured to measure a temperature of a surface. The temperature monitoring device includes a housing and a thermal sensor disposed in the housing. The temperature monitoring device also includes a thermal pad disposed on a measurement face of the housing, wherein the thermal pad is configured to provide a high-thermal conductivity path between the surface and the temperature monitoring device.

[0005] In another embodiment, a method includes disposing a thermal pad between a temperature monitoring device and a surface, wherein the thermal pad is in thermal contact with the temperature monitoring device and with the surface. The method includes reducing a pressure at the surface about the temperature monitoring device and periodically collecting temperature measurements of the surface using the temperature monitoring device.

(0006| In another embodiment, a method includes disposing a temperature monitoring device onto a surface to be monitored, w herein a thermal pad is disposed between the temperature monitoring device and the surface. The method further includes measuring and recording a temperature of the surface using a thermal sensor of a temperature monitoring device.

BRIEF DESCRIPTION OF THE DRAWINGS

[0007] These and other features, aspects, and advantages of the present invention will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent l ike parts throughout the drawings, wherein:

[0008] FIG. 1 is a schematic of an embodiment of a temperature monitoring device;

|0009] FIG. 2 is a partially exploded perspective view of an embodiment of a temperature monitoring device (e.g., a temperature logger) and a monitored surface; j 00101 FIG. 3 is a perspective view of an embodiment in which a plurality of temperature loggers are disposed within a freeze drying device; and

[0011 J FIG. 4 is a cross-sectional view of an embodiment of the temperature logger illustrated in FIG. 2, illustrating the temperature logger disposed on a monitored surface; and f 0012 J FIG. 5 is a schematic view of an embodiment a control system having a plurality of temperature monitoring devices (e.g., temperature sensors) configured to monitor temperatures of an oven unit under reduced pressure.

DETAILED DESCR IPTION

100131 One or more specific embodiments of the present invention wi l l be described below. In an effort to provide a concise description of these embodiments, al l features of an actual implementation may not be described in the specification. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers ^* specific goals, such as compl iance with system-related and business-related constraints, which may vary from one implementation to another. Moreover, it should be appreciated that such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure.

[0014] When introducing elements of various embodiments of the present invention, the articles "a," "an," "the, ^" and "said" are intended to mean that there are one or more of the elements. The terms "comprising," "including," and "having ^" are intended to be inclusive and mean that there may be additional elements other than the l isted elements.

[0015| As set forth above, temperature monitoring devices may be used to investigate the thermal properties of a monitored system. Certain types of temperature monitoring devices, referred to herein as temperature loggers, may collect and store temperature measurement data over a period of time in an internal memory for later analysis. For example, a temperature logger in a pharmaceutical manufacturing facility may collect temperature measurement data for a freeze drier during operation in order to verify proper operation of the freeze drier (e.g., for quality control purposes) during the manufacture of a pharmaceutical product. Other types of temperature monitoring devices, referred to herein as temperature sensors, may also include communication circuitry to provide temperature measurements to other devices during operation of the monitored system. For example, one or more temperature sensors may be used in industrial control systems (e.g.. gas turbine systems, wind turbine systems, steam turbine systems, hydraulic turbine system, power plants, petroleum refining systems, chemical production system, pharmaceutical manufacturing systems, and so forth) to collect temperature measurement data that may be used by a controller to determine how to control operation of the system. By specific example, a temperature monitoring device may collect temperature measurement data that may be used by a control ler of a gas turbine system to determine the operational temperature of a particular component (e.g., a compressor inlet) such that the controller may provide control signals to one or more components (e.g., compressor inlet guide vanes) of the gas turbine system to modify the operation of the gas turbine system in response to the collected temperature measurements.

[0016] As such, it may be appreciated that temperature monitoring devices, such as temperature sensors and temperature loggers, may operate to collect temperature data in a number of different types of environments. For example, certain temperature monitoring devices, such as surface temperature loggers and surface temperature sensors, may be configured for measuring the temperature of a solid surface as opposed to measuring the temperature of a fl uid, such as air or water. Additionally, temperature monitoring devices may operate over a range of temperatures, which may be generally limited by the nature of certain internal components (e.g., a battery, sensing circuitry, and so forth ) of each temperature monitoring device. For example, certain tem perature monitoring devices may operate to collect temperature measurement at cryogenic temperatures (e.g.. betw een approximately 0 °C and approximately - 1 00 °C, between approximately - 10 °C and approximately -90 °C, or between approximately -20 °C and approximately -85 °C ). or at relatively higher temperatures (e.g., between approximately 0 °C and approximately 160 °C, between approximately 20 °C and approximately 1 50 °C, or between approximately 50 °C and 140 °C), or may operate over a wide temperature window (e.g.. between approximately - 1 00 °C and approximately 1 60 °C, between approximately -90 °C and approximately 1 50 °C, or between approximately -85 °C and approximately 140 °C).

[0017] Further, certain temperature monitoring devices may also operate to collect temperature measurements in reduced pressure environments (e.g.. under vacuum ). For surface temperature monitoring devices, performing temperature measurements in a reduced pressure environment offers particular challenges. For exam ple, without the disclose embodiments, the surface of the temperature monitoring device may be disposed directly against the surface for temperature monitoring. As such, any non- uniformity (e.g., surface defect, manufacturing variation or irregularity) in the surface of the packaging of the temperature monitoring device and/or in the monitored surface may yield a gap (e.g., an air gap) between the temperature monitoring device and the monitored surface. Since the thermal conductivity of the gas (e.g.. air) in these gaps may be significantly less than the thermal conductivity of the packaging of the temperature monitoring device and the monitored surface, these gaps aff ect the accuracy of the temperature measurements collected by the temperature monitoring device. Furthermore, under reduced pressure, this problem is exacerbated as the gas disposed inside these gaps may be replaced with vacuum (e.g., a void), which may be an even poorer conductor of thermal energy. Accordingly, without the disclosed embod i ments, the accuracy of the temperature measurements col lected b a surface temperature monitoring device may be substantial ly affected by the nature of the contact (e.g.. surface contact, thermal contact) between the packaging of the temperature monitoring device and the monitored surface.

[0018] With the foregoing in mind, present embodiments are directed toward surface temperature monitoring devices, such as surface temperature loggers and surface temperature sensors, which enable an improved surface contact between the surface temperature monitoring device and the monitored surface. As set forth in detail below, the presently disclosed temperature monitoring devices include a thermal pad (e.g., an elastomeric polymer pad) that is disposed between the surface temperature monitoring device and the monitored surface. As discussed below, in certain embodiments, this thermal pad may be a polymer that may or may not be impregnated with other materials (e.g.. metallic micro- or nanoparticlcs ) to endow the thermal pad with a high thermal conductivity. Accordingly, this high thermal conductivity enables a relatively uniform heat transfer between the surface of the temperature monitoring device and the monitored surface. For example, the thermal pad may expand into the surface defects in the packaging of the temperature monitoring device and the monitored surface such that air gaps (under atmospheric pressure) or void gaps (under reduced pressure) are not present. As such, the presently disclosed temperature monitoring devices enable improved accuracy and thermal response for the collected temperature measurement data, especially for measurements performed in reduced pressure environments. Additional ly, in certain embodiments, the disclosed thermal pad may be reusable, which may provide advantages in terms of cost and environmental impact. Accordingly, the disclosed thermal pad may be useful for temperature sensors (e.g., in a control system environment), temperature loggers (e.g., for qual ity control in a manufacturing environment), or any other suitable temperature monitoring device to enable improved accuracy and thermal response.

[0019] FIG. 1 is a schematic illustrating an embodiment of a temperature monitoring device 1 0. I n particular, the temperature monitoring device 10 il lustrated in FIG. 1 may be a surface temperature sensor 10. As such, the surface temperature sensor 10 includes a packaging 12 (e.g.. a hermetical ly sealed housing) that houses the internal components of the surface temperature sensor 1 0. The packaging 1 2 may be any suitable thermally conductive packaging (e.g., metal lic, polymeric, ceramic, or composite packaging). By specific example, in certain embodiments, the packaging 12 may be made from stainless steel . The illustrated packaging 1 2 encloses the internal circuitry of the temperature monitoring device 1 0. For the i l lustrated embodiment, the temperature monitoring device 10 includes processing circuitry 14. memory circuitry 16, communication circuitry 1 8, thermal sensor 20, and power source 22. The processing circuitry 14 may be a general purpose central processing unit (CPU ) (e.g.. a complex instruction set computer (CISC) processor or a reduced instruction set computer (RI SC), or may be a specialized processor (e.g.. field- programmable gate array (FPG.A ) or application-specific integrated circuit (ASIC)), capable of executing instructions (e.g., firmware) stored in the memory circuitry 1 6. The i l lustrated memory circuitry 16 may include random access memor (RAM ), flash memory, electrically erasable programmable read-only memory (EEPROM ), a hard drive, a solid-state disk, or a combination thereof. The il lustrated communication circuitry 18 may include a network interface card (NIC ) that may- enable the temperature monitoring device 1 0 to communicate temperature measurement data to another device, such as a controller of an industrial control or monitoring system, via a wired or w ireless communication network. In other embodiments, such as embodiments in which the temperature monitoring device 10 is a temperature logger, the temperature measurements col lected by the thermal sensor 20 may be stored in the memory circuitry 16 for later access (e.g.. when the temperature logger is loaded into a docking station), which may be facilitated by the communication circuitry 1 8. The power source 22 may be a batten (e.g., a lithium ion batten,', a nickel metal hydride batten,', or another suitable battery ), a capacitor or capacitor bank, or another suitable power source 22. In certain embodiments, the temperature monitoring device 1 0 may be coupled to an external power source (e.g., a power outlet) and may therefore lack the internal power source 22.

|0020| The i l lustrated thermal sensor 20 is disposed directly against the packaging 12 on the measurement face 24 (e.g., the mounting interface) of the temperature monitoring device 10. In other embodiments, the thermal sensor 20 may be separated from the packaging 20 by one or more layers having a high thermal conductivity. In stil l other embodiments, only the measurement face 24 of the housing 1 2 of the temperature monitoring device 10 may be thermally conductive to enable efficient thermal transfer to the thermal sensor 20. Regardless, the thermal sensor 20 may generally be in thermal contact or thermal communication with the measurement face 24 of the temperature monitoring device 10. In certain embodiments, the thermal sensor 20 may be a resistance temperature detector (RTD), a thermocouple, a thermistor, or any other suitable electronic thermal measurement device. During operation of the i l lustrated temperature monitoring device 10, the processing circuitry 14 may execute one or more instructions stored within the memory circuitr 16 to cause the thermal sensor 20 to perform a temperature measurement, and the processing circuitry 14 may then collect and store the measurement in the memory- circuitry 16. The temperature measurement performed at the measurement face 24 of the temperature monitoring device 10 is representative of the temperature of the monitored surface 26. That is, as discussed below, the thermal pad 28 may general ly provide a low resistance thermal pathway, such that the temperature at the measurement face 24 of the temperature monitoring device 1 0 is approximately the same as the temperature of the monitored surface 26, even as the temperature of the monitored surface 26 quickly changes, improving the thermal responsiveness of the temperature monitoring device 10.

|0021 ] The i llustrated temperature monitoring device 10 may be capable of operating in different measurement environments. For example, temperature monitoring device 10 may operate at temperatures between approximately -85 °C and approximately 140 °C and at humidities between 0% and 100%. Additional ly , the temperature monitoring device 10 is capable of operation at higher pressures (e.g.. 1 0 bar) and at very low pressures (e.g., < 1 mill ibar, approximately 0 millibar, at nearly perfect vacuum). In certain embodiments, the packaging 1 2 temperature monitoring device 1 0 may be hermetical ly sealed and the communication circuitry 1 8 may enable temperature measurement data stored in the memory circuitry 1 6 to be extracted from the temperature monitoring device 10 (e.g., via radio frequency communication or via inductive communication with a docking station via the packaging 1 2). I n certain embodiments, the temperature monitoring device 10 may be capable of performing temperature measurements at a sampling rate between approximately one hundred measurements per second to approximately one measurement per twelve hours, including any suitable sub-range therein. Additionally, in certain embodiments, the temperature monitoring device 10 may be capable of storing at least 1 ,000, 10.000. 100,000. or more temperature measurements in the memory circuitry 16, along with metadata indicating, for example, when each temperature measurement was performed. In other embodiments, the temperature monitoring device 10 may additionally include circuitry to facilitate the measurement of other parameters (e.g., humidity, pressure, gas flow rates, gas composition, etc.) for storage along with the temperature measurement data.

[0022] In order to facilitate efficient thermal transfer between the temperature monitoring device 10 and the monitored surface 26. the temperature monitoring device 10 includes a thermal pad 28 that is d isposed between the measurement face 24 of the temperature monitoring device 10 and the monitored surface 26. As mentioned above, the thermal pad 28 may be an elastomeric material that may enable improved surface contact and/or thermal contact between the temperature monitoring device 10 and the monitored surface 26. That is, the thermal pad 28 may expand into any irregularities in the surface of the measurement face 24 of the temperature monitoring device 10 and/or the monitored surface 26 to provide continuous surface contact and a low-resistance thermal barrier (e.g., good thermal conductivity at the interface). Further, the thermal pad 28 may provide a high thermal conductivity path 30 (e.g., a low thermal resistance path) between the measurement face 24 of the temperature monitoring device 10 and the monitored surface 26. For example, in certain embodiments, the thermal pad 28 may provide a thermal conductivity greater than approximately 1 Watt per meter-Kelvin (W/mK), greater than approximately 2 W/mK, greater than approximately 2.5 W/mK, greater than approximately 3 W/mK. between approximately 1 W/m K and approximately 5 W/mK, between approximately 2 W/mK and approximately 4 W/mK, or between approximately 2.5 W/mK and approximately 3.5 W/mK.

[0023] In certain embodiments, the thermal pad 28 may be an elastomer, such as a silicone or acryl ic elastomer. By way of example, the thermal pad 28 may be a Si l- Pad®, such as the Sil-Pad® A2000 or Sil-Pad® 2000 available from the Bergquist Company of Chanhassen, MN. Such el astomers may provide a high thermal conductivity (e.g., greater than 1 W/mK. greater than 1 .5 W/m K, greater than 2 W/mK, greater than 2.5 W/mK, or approximately 3 W/m K) path 30 such that the measurement face 24 of the temperature monitoring device 10 is in good thermal contact or communication with the monitored surface 26. Further, in certain embodiments, these elastomers may be grease-free and may readi ly conform to surfaces and surface irregularities. Additionally, in certain embodiments, the thermal pad 28 may be adhered to the measurement surface 24 of the temperature monitoring device 10, may be adhered to the monitored surface 26, or both, using one or more adhesives (e.g., silicone adhesives, acrylic adhesives, glues, epoxies, resi ns, or other suitable adhesives). I n particular, in certain embodiments, acryl ic adhesives may enable a longer shelf l ife (e.g., 6 months longer) for the thermal pad 28 than other adhesives (e.g., sil icone adhesives).

[0024j I n certain embodiments, the thermal pad may be flat, curved, or shaped with any geometry to conform to the measurement face 24 of the temperature monitoring device 10, the monitored surface 26. or both. Additionally, as discussed in detail below, in certain embodiments the thermal pad 28 may be reusable. It may be noted that, whi le certain elastomers (e.g.. silicone elastomers) may also be electrically insulating, the thermal pad 28 may be electrical ly conductive in certain embodiments without negating the effect of the present approach. As mentioned above and discussed in detail below, the thermal pad 28 is especial ly advantageous for embodiments in which the temperature monitoring device 1 0 is collecting temperature measurements from the monitored surface 26 in a reduced pressure environment (e.g., under a vacuum) by maintaining continuous thermal contact or communication between the measurement face 24 of the temperature monitoring device 1 0 and the monitored surface 26.

[0025] FIG. 2 is a partially exploded perspective view of an embodiment of the temperature monitoring device 10, the thermal pad 28. and the monitored surface 26. The temperature monitoring device 1 0 illustrated in FIG. 2 is a temperature logger 1 0. As such, the il lustrated temperature logger 10 may be designed to be disposed on the monitored surface 26 prior to performing the temperature measurements, and designed to be removed from the monitored surface 26 after performing the temperature measurements. After removal, the temperature logger 1 0 may be subsequently loaded into a docking station, such that the temperature measurement data may be read from the memory circuitry 1 6 of the temperature logger 1 0. As such, in certain embodiments, the temperature logger 10 may be regularly (e.g., once per week, once per day, twice per day, after each operation of a piece of equipment that includes the monitored surface 26) disposed on, as well as removed from, the monitored surface 26.

[0026] For example, the monitored surface 26 may be a stainless steel shelf 26 of a freeze drying device of a pharmaceutical manufacturing facility. Turning briefly to FIG. 3, a plurality of temperature logger embodiments 10 are illustrated as being disposed on monitored surfaces 26 of a freeze drying device 32. That is. the freeze drying device 32 illustrated in FIG. 3 includes three shelves 26, wherein each of the three shelves 26 include five temperature loggers 10. As such, the freeze drying device 32 i l lustrated in FIG. 3 may represent a system in w hich temperature measurements are to be collected from five different locations on each shelf 26 throughout an operation of the freeze drying device 32. It may be appreciated that other embodiments may include any number of shelves (e.g., 1 , 2. 3, 4. 5, 6. 7. 8, 9, 10 or more shel ves) and may include any number of temperature loggers 10 (e.g., between I and 1 0 temperature loggers per shelf, between 2 and 8 temperature loggers per shelf, or between 3 and 5 temperature loggers per shel f)- During the manufacture of a particular pharmaceutical product, it may be desirable to monitor a temperature of the shelf 26 using the temperature logger 1 0 throughout each operation of the freeze drying device in order to satisfy regulator)' guidelines (e.g.. Food and Drug Administration (FDA) guidelines) and/or enable enhanced qual ity control.

[0027| As such, turning back to FIG. 2, for each operation of the freeze drying device, the temperature logger 10 may be assembled by first disposing the thermal pad 28 against the measurement face 24 of the temperature logger 1 0 before the temperature logger 10 is disposed on the shelf 26. In certain embodiments, the thermal pad 28 may be first disposed on the shelf 26. and temperature logger 1 0 may subsequently be assembled by disposing the packaging 1 2 on top of the thermal pad 28. In certain embodiments, the thermal pad 28 may be adhered to the measurement face 24 of the temperature logger 1 0 and/or the shelf 26 us ing gl ue, an epoxy. a resin, or another suitable adhesive material. However, in certain embodiments, the thermal pad 28 may be disposed between the measurement face 24 of the temperature logger

1 I 10 and the shelf 26 without the use of adhesives or thermal compounds (e.g., thermal grease or thermal paste). I t should be appreciated that such embodiments enable easier installation and removal of the temperature logger 10 (e.g., less application and cleaning time) between each operation of the freeze drying device and/or enable fewer potential contaminants from being introduced into the freeze drying device via the adhesives or thermal compounds. It should also be appreciated that certain embodiments of the thermal pad 28 may be reusable or recyclable, meaning that the thermal pad 28 may be applied to, removed from, and subsequently reapplied to the measurement face 24 of the temperature logger 10 for another measurement operation. In certain embodiments, the thermal pad 28 may be capable of being reused between 1 and approximately 30 times, between approximately 5 and approximately 25 times, between approximately 10 and approximately 20 times, or approximately 1 5 times.

[0028] FIG. 4 is a cross-sectional view of the embodiment of the temperature logger 10 illustrated in FIG. 2 when it is disposed on the monitored surface 26. As such, a first side 40 of the thermal pad 28 is disposed along the measurement face 24 of the packaging 12 of temperature logger 1 0 and expands into any irregularities in the measurement face 24 of the temperature logger 1 0 to provide a good, continuous surface contact. Additionally, a second side 42 of the thermal pad 28 is disposed along the monitored surface 26 and expands into any irregularit ies in the monitored surface 26 to provide a continuous surface contact. As such, the thermal pad 28 provides a high thermal conductivity path 30 (e.g., a low thermal impedance or resistance path 30) between the monitored surface 26 and the measurement face 24 of the temperature logger 10. Additional ly, as il lustrated in FIG. 4. the therma l pad 28 has a thickness 44 that may range between approximately 0.2 mil l imeters (mm ) and approximately 2 mm. betw een approximately 0.4 mm and approximately 1 mm. or between approximately 0.35 mm and approximately 0.5 mm. For example, in certain embodiments, the thermal pad 28 may have a thickness 44 of approximately 0.2 mm. approximately 0.3 mm, approximately 0.35 mm, approximately 0.4 mm. approximately 0.45 mm. or approximately 0.5 mm. In certain embodiments, the thickness 44 of the thermal pad 28 may not substantially change when the temperature logger 10 is placed in a reduced pressure atmosphere. Further, in certain embodiments, the thermal pad 28 may be sized to exactly match the dimensions of the measurement face 24 of the temperature logger 10. whi le in other embodiments, the thermal pad 28 may be slightly larger or smal ler than the measurement face 24 of the temperature logger 10. Additionally, it may be appreciated that the thermal pad 28 may be somewhat compressed (e.g., pressed down) as the temperature monitoring device 10 is installed or mounted on to the monitored surface 26, and this compressive force may generally facilitate the expansion of the thermal pad 28 into the surface irregularities of the measurement face 24 of the temperature monitoring device 10 and/or the monitored surface 26 during mounting.

[0029] FIG. 5 is a schematic view of a portion of a control system 60. In certain embodiments, the control system 60 may be part of, for example, a turbine system, a petrochemical refining system, a chemical production system, a pharmaceutical manufacturing system, or another suitable control system. The portion of the control system 60 illustrated in FIG. 5 includes a controller 62 having a processor 64 that is configured to execute instructions stored in the memory 66 to control operation of the control system 60, In general, the processor 64 of the controller 62 may be communicatively coupled to a number of devices, includi ng temperature monitoring devices 1 0, distributed throughout the control system 60 that may provide monitoring information to the controller 62. The illustrated control system 60 includes a vacuum oven system 68, in which an oven unit 70 is operated at elevated temperature (e.g., 120 °C) and within a reduced pressure envi ronment 72.

|0030J The vacuum oven system 68 includes a number of surface temperature sensors 1 0. in accordance with an embodi ment of the present approach, disposed agai nst a surface 74 (e.g.. an outer surface 74) of the oven unit 70. Each surface temperature sensor 1 0 is communicatively coupled to the controller 62 via a wired or wireless communication interface provided by the communication circuitry 1 8 discussed above. Additionally, each of the surface temperature sensors 1 0 has a thermal pad 28 disposed between the surface temperature sensor 10 and the outer surface 74 of the oven unit 70. As set forth above, the thermal pad 28 enables improved surface and/or thermal contact between the surface temperature sensors 10 and the surface 74 of the oven unit 70, As such, even within the reduced pressure environment 72. the surface temperature sensors 10 are in continuous thermal contact (e.g., thermal equil ibrium) with the outer surface 74 of the oven unit 70.

[0031] Technical effects of the invention include providing an improved surface contact and thermal contact between a surface temperature monitoring device (e.g., a surface temperature logger or surface temperature sensor) and the surface whose temperature is being monitored via the use of a thermal pad. This thermal pad may expand to occupy surface defects (e.g., manufacturing variation or irregularity) in the measurement face of the temperature monitoring device as wel l as the monitored surface. As such, the thermal pad prevents the occurrence of gaps (e.g.. air gaps under atmospheric pressure, voids under red uced pressure) that can create a thermal barrier between the temperature monitoring device and the monitored surface. Therefore, the presently disclosed surface temperature monitoring devices enable the collection of more accurate temperature measurements for the monitored surface as well as a better thermal response time for the temperature measurement device as the temperature of the monitored surface changes over time. These advantages may be applicable to any temperature measurement device, including temperature sensors of a control system and stand-alone temperature loggers.

1 0321 This written description uses examples to disclose the invention, including the best mode, and also to enable any person skil led in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may inc l ude other examples that occur to those ski lled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the l iteral language of the claims, or if they include equivalent structural elements with insubstantial di fferences from the l iteral language of the claims.