Title:
TAB LEAD MATERIAL AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2008/044763
Kind Code:
A1
Abstract:
A tab lead material which comprises a thin metal sheet material and which, when
used in a laminate package type cell or capacitor, has improved adhesion to a film
material to be bonded to this tab lead material. It is intended to thus heighten
the reliability of the cell or capacitor. This tab lead material (10) comprises
a thin metal sheet (11) and a nickel sulfamate deposit film (12) formed by plating
on the surface thereof. It may further have, formed on the surface of the deposit
film, a primer film (13) comprising chitosan or a derivative thereof. In this
tab lead material, the thin metal sheet preferably is one which has undergone
a heat treatment and the deposit film has a thickness of preferably 1.0-3.0 µm.
The metal may be copper or aluminum.
Inventors:
YAMAZAKI SATOSHI (JP)
TABATA IKUO (JP)
TABATA IKUO (JP)
Application Number:
PCT/JP2007/069939
Publication Date:
April 17, 2008
Filing Date:
October 12, 2007
Export Citation:
Assignee:
KYORITSU CHEMICAL & CO LTD (JP)
NETS CO LTD (JP)
YAMAZAKI SATOSHI (JP)
TABATA IKUO (JP)
NETS CO LTD (JP)
YAMAZAKI SATOSHI (JP)
TABATA IKUO (JP)
International Classes:
C25D5/48; C25D7/00; H01G4/228; H01G9/00; H01G9/008; H01G11/66; H01G11/74; H01G11/84; H01M50/534; H01M50/536
Foreign References:
| JP2006128096A | 2006-05-18 | |||
| JP2005011556A | 2005-01-13 | |||
| JP2002329493A | 2002-11-15 | |||
| JPH09263994A | 1997-10-07 | |||
| JP2001279489A | 2001-10-10 | |||
| JP2003201576A | 2003-07-18 |
Attorney, Agent or Firm:
MATSUYAMA, Masayuki (Ginyou Bldg.9-40, Kitasaiwai 2-chome,Nishi-ku, Yokohama-shi, Kanagawa 04, JP)
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