Title:
TABLE FOR CUTTING SHEET
Document Type and Number:
WIPO Patent Application WO/2007/049441
Kind Code:
A1
Abstract:
A table (13) for cutting a sheet is provided for cutting an unnecessary bonding
sheet region protruded from an outer circumference of a semiconductor wafer
(W) by a cutting apparatus (15) as an unnecessary bonding sheet (S1) after bonding
an adhesive sheet (S) on the semiconductor wafer (W). The table (13) is provided
with an inner table (52) for supporting the semiconductor wafer (W), and an outer
table (51) which corresponds to the unnecessary bonding sheet (S1) protruded
to the outside of the semiconductor wafer (W). An upper plane of the outer table
(51) is provided with a non-adhesive processing plane (51A) and an adhesive member
composed of a ring member (53) for bonding an adhesive sheet (S) or an adhesive
member composed of a board material (63).
Inventors:
NONAKA HIDEAKI (JP)
KOBAYASHI KENJI (JP)
SUGISHITA YOSHIAKI (JP)
KOBAYASHI KENJI (JP)
SUGISHITA YOSHIAKI (JP)
Application Number:
PCT/JP2006/319931
Publication Date:
May 03, 2007
Filing Date:
October 05, 2006
Export Citation:
Assignee:
LINTEC CORP (JP)
NONAKA HIDEAKI (JP)
KOBAYASHI KENJI (JP)
SUGISHITA YOSHIAKI (JP)
NONAKA HIDEAKI (JP)
KOBAYASHI KENJI (JP)
SUGISHITA YOSHIAKI (JP)
International Classes:
B26D3/10; B26D3/00; B26D3/08; B26D7/02; H01L21/304
Foreign References:
| JP2004047976A | 2004-02-12 | |||
| JPS61276231A | 1986-12-06 | |||
| JP2004266183A | 2004-09-24 | |||
| JP2004221469A | 2004-08-05 | |||
| JP2006095606A | 2006-04-13 | |||
| JP2006108503A | 2006-04-20 | |||
| JP2006102822A | 2006-04-20 |
Attorney, Agent or Firm:
YAMAGUCHI, Yoshio (Izumi Building 4-17, Tsurumaki 1-chom, Tama-shi Tokyo34, JP)
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