Title:
TABLET-TYPE EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEALED USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/236052
Kind Code:
A1
Abstract:
Provided are a tablet-type epoxy resin composition for sealing a semiconductor device, and a semiconductor device sealed using the same, and with respect to an entire tablet-type epoxy resin composition for sealing a semiconductor device: (i) the ratio of a tablet having a diameter greater than or equal to 0.1 mm and less than 2.8 mm and a height greater than or equal to 0.1 mm and less than 2.8 mm is 97 wt% or more when measurement is performed by sieving using an ASTM standard sieve; (ii) formula 1 is met when the standard deviation of the diameter is designated as σD and the standard deviation of the height is designated as σH after the diameter and the height of 50 tablets among the tablets are respectively measured; and (iii) the tablet has a compression density of 1.2-1.7 g/mL.
Inventors:
KIM SANG JIN (KR)
KIM SANG KYUN (KR)
EOM TAE SHIN (KR)
LEE DONG HWAN (KR)
LEE YOUNG JOON (KR)
CHO YONG HAN (KR)
KIM SANG KYUN (KR)
EOM TAE SHIN (KR)
LEE DONG HWAN (KR)
LEE YOUNG JOON (KR)
CHO YONG HAN (KR)
Application Number:
PCT/KR2018/005509
Publication Date:
December 27, 2018
Filing Date:
May 14, 2018
Export Citation:
Assignee:
SAMSUNG SDI CO LTD (KR)
International Classes:
C08L63/00; H01L21/56; H01L23/28
Foreign References:
| JP2009188142A | 2009-08-20 | |||
| KR20110104507A | 2011-09-22 | |||
| KR20160117316A | 2016-10-10 | |||
| JP2007194425A | 2007-08-02 | |||
| KR20050009234A | 2005-01-24 |
Attorney, Agent or Firm:
AJU INTERNATIONAL LAW & PATENT GROUP (KR)
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