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Patent Searching and Data


Title:
TABULAR SILVER PARTICLE, MANUFACTURING METHOD THEREFOR, PASTE USING SAME, AND PRINTED CIRCUIT USING PASTE
Document Type and Number:
WIPO Patent Application WO/2012/147945
Kind Code:
A1
Abstract:
Provided is a conductive paste that exhibits a low resistance even with thermal treatment at a low temperature of approximately 200°C. Also provided is a tabular silver particle wherein: organic matter with a carbon number of 2-10 is attached on the surface thereof; and the average particle diameter in the thickness direction calculated with an SEM image (hereafter referred to as dSEM-T) is 10-200 nm. The silver particle is characterized by having an aspect ratio, which is the ratio (dSEM-L/dSEM-T) between the average particle diameter in the lengthwise direction (dSEM-L) and the dSEM-T, of 2-100.

Inventors:
NAKANOYA TARO (JP)
HINOTSU TAKASHI (JP)
SAITO HIROTOSHI (JP)
Application Number:
PCT/JP2012/061448
Publication Date:
November 01, 2012
Filing Date:
April 27, 2012
Export Citation:
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Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
NAKANOYA TARO (JP)
HINOTSU TAKASHI (JP)
SAITO HIROTOSHI (JP)
International Classes:
B22F1/054; B22F1/102; B22F9/24; H01B1/00; H01B1/20; H01B13/00; H05K1/09
Domestic Patent References:
WO2007037440A12007-04-05
Foreign References:
JP2009013449A2009-01-22
JP2011080147A2011-04-21
JP2006196278A2006-07-27
JP2006339057A2006-12-14
Attorney, Agent or Firm:
HIROKOH, MASAKI (JP)
Hiroyuki Masaki (JP)
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Claims: